基本信息
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职业迁徙
个人简介
Professor Tu is a world leader in the science of thin films, especially in its applications in microelectronic devices, packaging and reliability. His recent work is on predicting failure in modern microelectronics based on entropy production.
Honors
IEEE Division of Components, Packaging, and Manufacturing Technology Award in 2017
Materials Research Society - Fellow 2014
TMS John Bardeen Award in 2011
TMS-EMPM Division Distinguished Scientist/Engineer Award in 2006
Member of Academia Sinica, ROC, 2002
Humboldt Research Award for Senior US scientists, 1996
Acta/Scripta Metallurgical Lecturer, 1990 - 1992
Churchill College - Overseas Fellow, 1990
The Metallurgical Society - Fellow, 1988
Materials Research Society - President, 1981
The Metallurgical Society - Application to Practice Award, 1981
American Physical Society - Fellow, 1981
Honors
IEEE Division of Components, Packaging, and Manufacturing Technology Award in 2017
Materials Research Society - Fellow 2014
TMS John Bardeen Award in 2011
TMS-EMPM Division Distinguished Scientist/Engineer Award in 2006
Member of Academia Sinica, ROC, 2002
Humboldt Research Award for Senior US scientists, 1996
Acta/Scripta Metallurgical Lecturer, 1990 - 1992
Churchill College - Overseas Fellow, 1990
The Metallurgical Society - Fellow, 1988
Materials Research Society - President, 1981
The Metallurgical Society - Application to Practice Award, 1981
American Physical Society - Fellow, 1981
研究兴趣
论文共 287 篇作者统计合作学者相似作者
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Xingchao Mao, Yuxuan An,Yang Chen,Gong Zheng,Rui Hou, Xinyu Zhang,Yuzheng Guo,Sheng Liu,King-Ning Tu,Yingxia Liu
Journal of Materials Research and Technology (2024): 1136-1147
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.316-319, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.369-372, (2023)
2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)pp.1-2, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
Po-Ning Hsu,Kai-Cheng Shie,Kuan-Peng Chen, Jing-Chen Tu, Cheng-Che Wu,Nien-Ti Tsou,Yu-Chieh Lo,Nan-Yow Chen, Yong-Fen Hsieh, Mia Wu,Chih Chen,King-Ning Tu
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