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个人简介
Wei-Lan Chiu received the B.S. degree in physics from National Cheng Kung University, Tainan, Taiwan, in 2008, and the M.S. degree in physics and the Ph.D. degree in materials science and engineering from National Chiao Tung University (NCTU), Hsinchu, Taiwan, in 2010 and 2015, respectively.
From 2015 to 2016, he was a Post-Doctoral Researcher with NCTU. Since 2016, he has been a Deputy Project Manager and he is currently with the Industrial Technology Research Institute, Hsinchu. His research interests include the research of thermal migration and metallurgical reaction on microbumps in three-dimensional integrated circuits (3D IC) packaging, metal electroplating of nanotwinned Cu (nt-Cu) redistribution layer (RDL), and the development of nt-Cu/SiO2 hybrid bonding process at low temperature.
Dr. Chiu was a recipient of the Electronic and Optoelectronic System Research Laboratories of Industrial Technology Research Institute Outstanding Research Award in 2021.
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Applied Surface Sciencepp.160103, (2024)
Applied Surface Science (2024)
Surfaces and Interfaces (2023): 103076-103076
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2023 International Conference on Electronics Packaging (ICEP)pp.13-14, (2023)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 8 (2023): 1316-1323
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)pp.1549-1552, (2023)
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Journal of Electroanalytical Chemistry (2023): 117328-117328
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1549-1552, (2023)
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