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Kota Shiba (Student Member, IEEE) was born in Tokyo, Japan, in 1995. He received the B.S. and M.S. degrees in electronics and electrical engineering from Keio University, Yokohama, Japan, in 2018 and 2020, respectively. He is currently pursuing the Ph.D. degree with The University of Tokyo, Tokyo, Japan. He is a Research Assistant with the Graduate School of Engineering, The University of Tokyo (SEUT-RA) since 2020, and will be a JSPS research fellow (DC2) since 2021.
Since 2017, he has been involved in research on the inter-chip wireless interface for 3D system integration. His current research interests include inductive coupling wireless communication, high-speed I/O interface, 3D-SRAM-based hardware architecture, and 3D system integration.
Mr. Shiba was a recipient of the IEEJ Tokyo Branch Student Encouragement Award in 2018.
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IEEE Solid-State Circuits Letters (2024): 22-25
IEEE Solid-State Circuits Letters (2023): 65-68
IEEE Journal of Solid-State Circuitsno. 7 (2023): 2075-2086
2023 28th Asia and South Pacific Design Automation Conference (ASP-DAC)pp.180-181, (2023)
Japanese Journal of Applied Physicsno. SC (2023)
2022 20th IEEE Interregional NEWCAS Conference (NEWCAS)pp.99-103, (2022)
2022 IEEE Asian Solid-State Circuits Conference (A-SSCC)pp.1-3, (2022)
IEICE Transactions on Electronicsno. 7 (2022): 391-394
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