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职业迁徙
个人简介
LiangYu Chen received the Ph.D. degree in experimental condensed matter physics from Case Western Reserve University, Cleveland, OH, in 1994.
After graduation, he joined the NASA Glenn Research Center, Cleveland, as a National Research Council Research Fellow studying surface and interface stability of silicon carbide-based high-temperature chemical sensors to improve device performance and understand device failure mechanisms. Following his fellowship, he joined the Ohio Aerospace Institute as a Senior Researcher. He currently supports the high-temperature electronic packaging program at NASA Glenn Research Center. His current research interests include advanced packaging materials and material interfacial properties for high-temperature and other harsh environment applications.
研究兴趣
论文共 69 篇作者统计合作学者相似作者
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Philip G. Neudeck,Liang Yu Chen, Lawrence C. Greer, David J. Spry,Norman F. Prokop,Dorothy Lukco,Michael J. Krasowski,Gary W. Hunter
Solid State Phenomena (2024): 7-12
Key engineering materials (2023): 77-82
Additional conferences (Device packaging, HiTEC, HiTEN, & CICMT)no. HiTEC (2021): 000069-000075
Journal of microelectronics and electronic packagingno. 2 (2019): 78-83
Materials science forum (2018): 949-952
Additional conferences (Device packaging, HiTEC, HiTEN, & CICMT)no. HiTEC (2018): 000071-000078
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作者统计
#Papers: 65
#Citation: 2540
H-Index: 24
G-Index: 50
Sociability: 5
Diversity: 0
Activity: 0
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