基本信息
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个人简介
Patrick Ong received the Diploma Physiker degree from the University of Hamburg, Hamburg, Germany, in 2001.
In 2006, he joined the Interuniversity Microelectronics Centre (imec), Leuven, where he was involved in the development of Front End of Line process. He is currently a Senior Process Engineer of chemical mechanical polishing (CMP) at imec, where he is involved in the oxide CMP for STI/FinFET applications, Ge/SiGe CMP, and III-V CMP.
研究兴趣
论文共 33 篇作者统计合作学者相似作者
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IEEE Conference Proceedings (2020): 1-2
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Chi Lim Tan,Simone Lavizzari,Pieter Blomme,L. Breuil,Guglielma Vecchio,Farid Sebaai,Vasile Paraschiv,Zheng Tao,Bart Schepers,Laura Nyns,Antony Peter,Harold Dekkers,Patrick Ong,Diana Tsvetanova,K. Devriendt,Lieve Teugels,Nancy Heylen,Tom Raymaekers,Nico Jossart, Pasquale Mennella,Romain Delhougne,Senthil Vadakupudhu Palayam,A. Arreghini,Geert Van den bosch,A. Furnemont
Diana Tsvetanova, Takeshi Iizumi, Ban Ito, Gael Royere, Fabien Durix,Katia Devriendt,Patrick Ong,Herbert Struyf
ICPT 2017; International Conference on Planarization/CMP Technologypp.1-5, (2017)
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Patrick Ong,Lieve Teugels, Martine Delande,Sheikh Ansar,Rithu Bhonsle, Max Siebert,Leonardus Leunissen
2015 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT) (2015)
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openalex(2015)
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作者统计
#Papers: 33
#Citation: 572
H-Index: 14
G-Index: 23
Sociability: 5
Diversity: 2
Activity: 0
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