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个人简介
Rui Zhang received the B.S. degree in materials science and engineering from Tsinghua University, Beijing, China, in 2013, and the M.S. degree in materials science and engineering from the University of Florida, Gainesville, FL, USA, in 2015. He is currently pursuing the Ph.D. degree in electrical engineering with the 3-D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA, under the supervision of Prof. R. R. Tummala.
His current research interests include 3-D glass-based photonic interposer technology, low-loss dielectrics for optical communication, and fine-line redistribution layers (RDL) and microvias for high-speed electronics.
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 3 (2020): 393-399
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)pp.1132-1139, (2020)
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)pp.1132-1139, (2020)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 8 (2020): 1411-1418
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2019): 2016-2023
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