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Timothy B. Huang received the B.S. and M.S. degrees in materials science and engineering from the University of Illinois at Urbana–Champaign, Champaign, IL, USA, in 2010 and 2012, respectively. He is currently pursuing the Ph.D. degree in materials science and engineering with the Georgia Institute of Technology, Atlanta, GA, USA.
He was a Research and Development Intern at Atotech USA, Inc., Englewood, CO, USA. He is currently a Graduate Research Assistant with the 3-D Systems Packaging Research Center, Georgia Institute of Technology. His current research interests include interfacial adhesion characterization and process development for Cu metallization on glass interposers as well as electrochemical analysis of organic additives in electrolytic Cu plating baths.
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 4 (2017): 544-551
International Symposium on Microelectronicsno. 1 (2014): 000402-000408
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