Tushar Mandrekar - Applied Materials Inc., Santa Clara, CA, USA

基本信息

浏览量：28

职业迁徙

个人简介

暂无内容

研究兴趣

论文共 18 篇作者统计合作学者相似作者

按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选

SELF ALIGNED TRIPLE PATTERNING

Bencherki Mebarki, Hao Chen,Kedar Sapre, Anchuan Wang,Tushar Mandrekar,Jingmei Liang,Yongmei Chen, Christopher S Ngai, Mehul S Naik

mag（2012）

引用27浏览0引用

Innovative self-aligned triple patterning for 1x half pitch using single spacer deposition-spacer etch step

Bencherki Mebarki, H D Chen,Yongmei Chen,Aunchan Wang,Jingmei Liang,Kedar Sapre,Tushar Mandrekar,Xiaolin Chen,Ping Xu,Pokhui Blanko,Chris Ngai,Chris Bencher,

Proceedings of SPIE（2011）

引用12浏览0引用

Innovative self-aligned triple patterning for 1x half pitch using single

Bencherki Mebarki, Hao D Chen,Yongmei Chen,Aunchan Wang,Jingmei Liang,Kedar Sapre,Tushar Mandrekar,Xiaolin Chen,Ping Xu,Pokhui Blanko, Christopher Sui Wing Ngai, Chris Bencher,

mag（2011）

引用24浏览0引用

Conformal doping of 3-D structures using sub-atmospheric CVD films

Tushar Mandrekar, Miguel Angel Lagunas Hernandez, Jing Hua, V Ton,Avneesh Bhatnagar,Shailendra Raj Mehta, S Venkataraman

2010 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE（2010）

引用2浏览0EIWOS引用

Enabling Effective Work Function Tuning by RF-PVD Metal Oxide on High-k Gate Dielectric

Naomi Yoshida,Xianmin Tang,Khaled Ahmed, G. Conti,Dave Liu,Melody Agustin,Steven Hung,Victor Ku,Osbert Chan, Robert Liang,Hao Chen,Rongjun Wang,

Meeting Abstractsno. 1 (2008): 143-150

引用2浏览0引用

Manufacturable Processes for $\leq$ 32-nm-node CMOS Enhancement by Synchronous Optimization of Strain-Engineered Channel and External Parasitic Resistances

Atif M. Noori,Mihaela Balseanu, Pieter Boelen,Andrew Cockburn,Steven Demuynck,Susan Felch, Srinivas Gandikota, A. Jerry Gelatos, Amit Khandelwal,Jorge A. Kittl, Anne Lauwers,Wen-Chin Lee,

IEEE TRANSACTIONS ON ELECTRON DEVICESno. 5 (2008): 1259-1264

引用40浏览0EIWOS引用

Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm interconnects

Laureen Carbonell,Henny Volders, Asad Haider,Nancy Heylen,Olivier Richard,Roger Palmans,Youssef Travaly,Zsolt Tokei,Pieter Boelen, Aron Rosenfeld,Tushar Mandrekar,Jose Luis Hernandez,

ADVANCED METALLIZATION CONFERENCE 2007 (AMC 2007) (2008): 221-227

引用0浏览0引用

Cu Resistivity Scaling Limits for 20nm Copper Damascene Lines

J Van Olmen,S List,Zs Tokei,L Carbonell,S H Brongersma,Henny Volders,E Kunnen,N Heylen,I Ciofi,Alok R Khandelwal, J Gelatos,Tushar Mandrekar,

Burlingame, CA（2007）

引用10浏览0EIWOS引用

Barrier Integrity Effect on Leakage Mechanism and Dielectric Reliability of Copper/OSG Interconnects

Yunlong Li,Zsolt Tökei,Tushar Mandrekar, Bencherki Mebarki, Guido Groeseneken, Karen Maex

MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGSno. 1 (2005): 265-270

引用3浏览0引用

Ni based silicides for 45nm CMOS and beyond

Anne Lauwers,Jorge A. Kittl,Mark J.H. Van Dal,Oxana Chamirian,Malgorzata A. Pawlak,Muriel de Potter,Richard Lindsay,Toon Raymakers,Xavier Pages,Bencherki Mebarki,Tushar Mandrekar,Karen Maex

Materials Science and Engineering: B (2004): 29-41

引用77浏览0EI引用

加载更多

作者统计

合作学者

合作机构

D-Core

合作者
学生
导师

暂无相似学者，你可以通过学者研究领域进行搜索筛选

数据免责声明

页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果，我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问，可以通过电子邮件方式联系我们：report@aminer.cn