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Venky Sundaram (M'10) received the B.S. degree in metallurgical engineering from the Indian Institute of Technology, Mumbai, India, and the M.S. and Ph.D. degrees in materials science and engineering from the Georgia Institute of Technology (Georgia Tech), Atlanta.
He is the Director of Research with the Packaging Research Center (PRC), Georgia Tech, and also serves as the Program Manager for the Silicon and Glass Package Consortium. He has been with PRC since 1997, focusing on system-on-package technology, ultra-high density substrates, and systems integration research. He is advising iNEMI on the new wiring density initiative. He is a Co-Founder of Jacket Micro Devices, Atlanta, GA, a radio frequency substrate and module Georgia Tech PRC Spin-off Company acquired by AVX. He has several U.S. and international patents and has more than 100 publications in the systems packaging technology space.
Dr. Sundaram has won several Best Paper and Poster Awards and serves as Session Chair for advanced packaging topics at international conferences. He is a member of the IEEE Components, Packaging, and Manufacturing Technology Technical Committee of High Density Substrates.
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2012): 63-70
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