3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Three-dimensional (3D) integration using through-silicon vias (TSVs) and low-volume lead-free solder interconnects allows the formation of high signal bandwidth, fine pitch, and short-distance interconnections in stacked dies. There are several approaches for 3D chip stacking including chip to chip, chip to wafer, and wafer to wafer. Chip...More