TSVs embedded in a microfluidic heat sink: High-frequency characterization and thermal modeling

ieee workshop on signal and power integrity, pp. 1-4, 2016.

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Abstract:

This paper demonstrates the integration of microfluidic cooling for thermally limited 3-D microsystem applications. Thermal modeling of logic and memory dice on a silicon interposer is presented under air and microfluidic cooling conditions. Moreover, the electrical characteristics of micropin-fin-embedded through silicon vias (TSVs) imme...More

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