Process Complexity and Cost Considerations of Multi-Layer Die Stacks

Dimitrios Velenis,Joeri De Vos,Soon-Wook Kim,Jaber J. Derakhshandeh,Pieter Bex,Giovanni Capuz,Samuel Suhard,Kenneth June Rebibis,Stefaan Van Huylenbroeck,Erik Jan Marinissen,Alain Phommahaxay,Andy Miller,Gerald Beyer,Geert Van der Plas,Eric Beyne

2019 International 3D Systems Integration Conference (3DIC)（2019）

引用 1|浏览58

暂无评分

摘要

The increased requirements of data processing and reduced data latency has driven the demand for multi-layer 3D stacks for high performance systems and memory applications. In this paper, different approaches for multi-layer stacking are considered, including wafer-to-wafer (W2W) and die-to-die (D2D) stacking. The complexity of each approach is evaluated in terms of manufacturing cost and its impact on the stacked-system yield.

查看译文

关键词

W2W stacking,D2W stacking,hybrid bonding,hole-in-one,microbump,thermocompression bonding,3D integration,cost of ownership

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要