• 学术搜索
  • 科研智能体
    • Research Labs
    • AI 阅读
    • AI 文库
    • 深度研究
    • 学者亮点
  • 学术资源
    • AI2000
    • 期刊/会议
    • 学者库
    • 学术API
      MCP&Skill
    • 溯源树
    • 数据集
  • 知识沉淀
    • 学术空间
订阅小程序
旧版功能
aminer vip
开通会员低至0.73元/天
一次搞定AI科研
立即登录
  • English
  • 联系方式
    IEEE International Conference on Semiconductor Electronics

    IEEE International Conference on Semiconductor Electronics

    Conference

    年发文量

    研究主题

    论文(425)

    排序
    1Design of a Micromechanical System Utilizing Hydrogel Force for Controlling a Microvalve
    Masoomeh Tehranirokh,Burhanuddin Yeop Majlis,Badariah Bais

    A hydrogel actuated microsystem employed in controlling the opening-closing states of a microvalve is described. This microsystem consists of a flexible silicone rubber diaphragm with an attached silicon boss and a cantilever beam. Swelling of the hydrogel forces the bossed membrane and consequently the cantilever beam to be deflected. Simulations were done by FEM analysis and the results show enough deflections to open the valve and let the fluid flow through the microvalve.

    2008
    引用
    AI阅读
    加入学术空间
    2Characterization of Hna Etchant for Silicon Microneedles Array Fabrication
    Norazreen Abd Aziz,Badariah Bais,Azrul Azlan Hamzah,Burhanuddin Yeop Majlis

    Research on microneedles has been increasing rapidly to overcome the drawbacks of hypodermic needle which can results in painful injection, tissue damage and uncontrollable delivery rate. This paper presents process characterization of wet isotropic etching for solid microneedles array development. Work has been carried out to investigate the isotropic etching behavior in 17 different compositions of HNA solution. The experimental responses of vertical etch rate and lateral etch rate are presented. Resulting surface profiles from various HNA compositions are also reported. The etching properties will be applied to develop recipe to fabricate the optimum solid microneedles.

    2008引用:27
    引用
    AI阅读
    加入学术空间
    3Electroluminescent from Hybrid of Cdse Quantum Dot-Organic Light Emitting Diode
    Suhaila Sepeai,A. Ali Umar,Muhamad Mat Salleh,Muhamad Yahaya

    This paper reports the fabrication of a quantum dots (QD)-organics hybrids light-emitting diode (LED) for potential light sources. Organic light emitting diode (OLED) have become a focus of attention since past decades for potential light sources in a flat panel displays applications. Despite their intriguing performance in producing rich-color light emission, they still faced several critical defects, such as relatively low-brightness, low-chemical and photostability and short lifetime. Here, we demonstrate a novel system for the production of pure-color light emission with exceptionally high brightness by utilizing quantum dots that are hybridizing with light emitting organic materials, as an active material in light - emitting diode devices. Organic-quantum dots hybrid LED devices was fabricated by sandwiching the quantum dots monolayer between the electron transport layer (ETL) and hole transport layer (HTL) in a conventional OLED structure (ITO/ETL/QD/HTL/Al). Quantum dots of CdSe (ZnS) core-shell structure were function as the emitting layer. The ETL and HTL were poly(vinyl carbazol), PVK and tris(8-quinolinolato)aluminum(III), Alq3; respectively. The current-voltage (I-V) characterization on the device was found that the hybrid LED exhibited a strong blue emission under a relatively low bias voltage, of which their turn-on voltage was as low as 5.0 V.

    2008引用:3
    引用
    AI阅读
    加入学术空间
    4Thermal Management Issues in Laser Diode Packaging
    Alok Jyoti Verma,R. Makkar,K. Chalapathi

    SAMEER has recently setup an infrastructure to 'Pigtail and package Laser diodes' using optical epoxy and laser weld techniques. Few Laser diodes have been packaged using 'Fiber Alignment and Laser Weld System (FALWS)' in Butterfly and TO-CAN packages. The high power laser diode packaging involves good thermal management and post-weld shift challenges, and it is being experimentally verified with theoretical simulation. The Laser Diode packaging followed by reliability test as per Telcordia standard is the current technical challenges ahead.

    2008引用:2
    引用
    AI阅读
    加入学术空间
    5Design of MEMS Biomedical Pressure Sensor for Gait Analysis
    Yufridin Wahab,Aladin Zayegh,Rezaul K. Begg,Ronny Veljanovski

    Measurement of the foot and shoe interface pressure underpins a number of important applications. Abnormal pressure may indicate instability in gait, risks of diabetic ulceration and many other biomedical and sports applications. As the current foot pressure sensors in the market exhibit many limitations, a new sensor design based on the more promising MEMS technology was therefore explored. As such, this paper reports the analysis and optimization of a MEMS pressure sensor for foot pressure measurement. The pressure sensor had a high linearity output with pressure span of more than 2-MPa. This characteristic indicates excellent potential for a wide spectrum of biomechanical activities.

    2008引用:27
    引用
    AI阅读
    加入学术空间
    立即登录,查看全部 425 篇论文

    高被引作者

    作者引用发文
    Burhanuddin Yeop Majlis28642
    Kamarulazizi Ibrahim2445
    Y. K. Sin2211
    Ghader Rezazadeh1386
    Zainuriah Hassan13812
    Sahbudin Shaari13224
    Masuri Othman11410
    Fong Kwong Yam1026
    Ahmadali Tahmasebi792
    Abang Annuar Ehsan759

    高产作者

    作者引用发文
    Burhanuddin Yeop Majlis28642
    Sahbudin Shaari13224
    Ibrahim Ahmad3814
    Zainuriah Hassan13812
    Razali Ismail4011
    Masuri Othman11410
    Azlan Abdul Aziz3610
    Assoc. Prof. Ir. Ts. Dr. Mohd Shukor Salleh1710
    Abang Annuar Ehsan759
    Muhamad Mat Salleh399

    相关期刊

    Informacije MIDEM
    Electronics and Communications in Japan
    Iete Technical Review
    Journal of Electrical Engineering-elektrotechnicky Casopis
    Solid State Electronics Letters
    International Conference on E-Business and E-Government
    International Semiconductor Conference
    IEEE International Conference on Electronics and Nanotechnology
    JOURNAL of ACTIVE and PASSIVE ELECTRONIC DEVICES
    International Conference on Perspective Technologies and Methods in MEMS Design