• 学术搜索
  • 科研智能体
    • Research Labs
    • AI 阅读
    • AI 文库
    • 深度研究
    • 学者亮点
  • 学术资源
    • AI2000
    • 期刊/会议
    • 学者库
    • 学术API
      MCP&Skill
    • 溯源树
    • 数据集
  • 知识沉淀
    • 学术空间
订阅小程序
旧版功能
aminer vip
开通会员低至0.73元/天
一次搞定AI科研
立即登录
  • English
  • 联系方式
    International Spring Seminar on Electronics Technology

    International Spring Seminar on Electronics Technology

    Conference

    年发文量

    研究主题

    论文(3)

    排序
    1Evaluation of Inductive Displacement Sensors for a Basic Active Magnetic Bearing Test Rig
    M. Recheis,J. Nicolics,H. Wegleiter,B. Schweighofer,P. Fulmek

    In order to fulfill the requirements of an active magnetic bearing used for automotive application, two different inductive displacement sensor principles are evaluated. A basic test system is constructed in order to evaluate the sensor hardware. The results of the displacement measurement tested in a closed loop control operation are presented. Furthermore the test rig's performance is evaluated using two different control structures. A PID control and a state space control, by means of a Kalman Filter, are used.

    2011引用:4
    引用
    AI阅读
    加入学术空间
    2Ultrasonic Flowmeter
    M. Comes,P. Drumea,M. Blejan,I. Dutu, A. Vasile

    The ultrasonic flow-meter made by the authors, measures the frequency shifts caused by the liquid flow, using two pairs of transducers mounted in a case attached to both ends of the pipe. In the original configuration the sound waves travel between the devices that are in line with the direction of the liquid flow. The speed of the signal traveling between the transducers increases or decreases with the direction of transmission and the velocity of the liquid being measured. The phase shift of received signals, caused by frequency shift is proportional to the liquid's velocity. The signals are processed with a microcontroller included on the embedded electronics board, the results being displayed on a LCD.

    2006引用:5
    引用
    AI阅读
    加入学术空间
    3Highlights of the DACTEL Project: Development of Adhesive Chip Technologies for Dedicated Electronic Applications.
    Jan Vanfleteren,Alfons Vervaet,André Van Calster

    DACTEL is an EC funded Brite-Euram project (1996-1999), where different aspects of flip-chip technology development using adhesives were studied : adhesive development, dedicated test chip design and fabrication, electroless Ni/Au bumping of test chips, modelling, flip-chip technology development on different kinds of substrates : glass (FCOG), flex foil (FCOF), PCB (FCOB), ceramic materials (FCOC), and finally reliability testing of the developed technologies. The highlights of the different activities are presented in this paper.

    2000引用:24
    引用
    AI阅读
    加入学术空间

    高被引作者

    作者引用发文
    P. Drumea261
    Comes, M.261
    Marian Blejan261
    I. Dutu261
    Alfons Vervaet241
    Andre Van Calster241
    Jan Vanfleteren241
    Manes Recheis41
    Johann Nicolics41
    Hannes Wegleiter41

    高产作者

    作者引用发文
    P. Drumea261
    Jan Vanfleteren241
    Paul Fulmek41
    Alfons Vervaet241
    Marian Blejan261
    Manes Recheis41
    Comes, M.261
    I. Dutu261
    Hannes Wegleiter41
    Andre Van Calster241

    相关期刊

    Information Security Solutions Europe
    Electronics and Communications in Japan
    International Conference on Advanced Semiconductor Devices and Microsystems
    Electronics Packaging Technology Conference
    International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
    International Symposium on Semiconductor Manufacturing
    Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
    Electronics System-integration Technology Conference
    European Microelectronics and Packaging Conference
    Electronic Packaging Technology Conference