The results of investigation of effect of PVDF films polarization in glow discharge plasma on their properties are presented. The dependences of the piezoelectric coefficient d33 on the plasma polarization parameters – treatment time, discharge voltage and current density – were obtained experimentally. The IR spectra of PVDF film samples polarized in glow discharge plasma are presented. The character of the influence of polarization parameters on the values of IR spectral peaks characteristic of α- and β-phases is determined.
The article presents the results of studies on the influence of substrate material, application parameters, and Indium Tin Oxide (ITO) coating thickness on its functional characteristics (transparency and surface resistance). Coatings of different thicknesses were applied by magnetron sputtering to two types of substrates: glass and polyethylene terephthalate (PET) film. The optical parameters were studied using spectrophotometry (in the visible wavelength range), while the surface resistance was measured using the four-point van der Pauw method. As a result, the optimal values of the application parameters and ITO coating thickness for each type of substrate were determined, balancing transparency and surface resistance, with a view to their subsequent use as transparent electrodes in microelectronics, optoelectronics, acousto-optics, solar energy, and other fields.
Introduction. When manufacturing printed circuit boards (PCBs), including their prototypes, the proper alignment of PCB layers is mandatory. While the causes and preventive measures against misalignment in PCBs manufactured using conventional technologies are known, research into alignment errors in 3D-printed PCBs is still ongoing. Another task regarding 3D printing, which is related to topological accuracy (alignment errors in particular), consists in ensuring the opportunity to remove the printed part of the product in order to perform operations thereon, such as embedding components, followed by its return and continuation of the printing process.Aim. Numerical estimation and analysis of the causes of layer-to-layer alignment errors in PCBs manufactured using 3D printing.Materials and methods. The research was conducted using the following materials and equipment: Polyethyleentereftalaatglycol (PETG); an Ultimaker Cura slicer; an Ender 3 S13D printer; a brass nozzle with a diameter of 0.3 mm. The study was conducted using the facilities of the Additive Technologies Center, Bauman Moscow State Technical University. Interlayer alignment errors are estimated by microsection analysis and X-ray inspection, as well as using the misalignment decomposition method described by Yu.B. Tsvetkov for electronics.Results. The possibility of manufacturing PCB prototypes with three conductive layers is demonstrated, including a method for removing the printed part of the product and its further return in the printing process using printed pins. Large-scale distortions were found to make the largest contribution to the alignment error: on average, approximately 150 gm for each layer when compared to its 3D model and approximately 60 gm when comparing the topology of the top layer with the bottom layer. These values exceed the common misalignment value of 50 gm for the pin lamination process. This substantiates the need to control and minimize temperature effects, e.g., using 3D printers with a thermostatically-controlled chamber.Conclusion. The conducted analysis of possible causes of misalignment emergence determines the significance of temperature gradients that occur during 3D printing. The proposed manufacturing method allows the printed part of the product to be removed and further returned into the printing process, which can be used to produce PCB prototypes with three conductive layers.
the work examines the areas of application of sensors based on ferroelectric PVDF films and shows that for many applications the transparency of sensors is an important property. ITO thin film electrodes are used to maintain the transparency of the original PVDF film. In this paper, the dependence of the optical transmission and surface resistance of thin ITO films with a thickness of 100 nm obtained by direct magnetron sputtering at direct current on the value of the sputtering power is studied. It was found that in the studied power range, the best ratio of the optical transmission coefficient of 82% and the surface resistance of 83.9 ohms/sq corresponds to a spray power of 100 W.
The work is devoted to the development of a system modes for the PVDF films polarization in a glow discharge plasma. The choice of polarization method in a glow discharge plasma has been justified through comparison of modern polarization methods. Requirements for a plasma polarization unit are formulated. The choice of the frame concept of the electrode system is justified and the design of a created unit is described. A study of the influence of glow discharge plasma treatment on PVDF film surface properties was carried out. AFM scans of the surfaces of untreated and plasma treated samples of PVDF films are shown. The comparison of IR spectra of PVDF film treated in a glow discharge plasma at specified parameters of the processing mode and spectra of exact untreated were analyzed. The fact of glow discharge plasma polarization ability to pole a PVDF film is justified by results of polled 28 μm-thick PVDF film samples d33 measurements.
The article discusses the polarization technique using glow discharge plasmas of ferroelectric PVDF films. The polarization of oriented, unpoled samples of PVDF with a thickness of 25 mu m was studied in a glow discharge configuration with two flat electrodes, under different conditions. The value of the piezoelectric constants was measured by Berlincourt technique using a d33-meter (d33). The results of the measurements demonstrate a significant difference in piezoelectric response between unpoled and plasma-treated PVDF films, with respect to the d33 parameter. The dependence of the piezoelectric response (d33) on various parameters of the plasma polarisation process has been determined. A study of structural changes in ferroelectric film samples has been conducted using IR spectroscopy and DSC. AFM techniques, including Kelvin probe force microscopy (K-PFM) and piezoelectric force microscopy (PFM). Studies of the structure of PVDF film samples using IR spectroscopy and DSC techniques have revealed an increase in the proportion of the beta phase, which influences the piezoelectric characteristics of the films. Piezoelectric AFM data have also confirmed an improvement in piezoelectric performance.
Обработка в плазме тлеющего разряда все активнее применяется для очистки поверхностей материалов от загрязнений, уменьшения шероховатости поверхности, повышения поверхностной энергии и модификации поверхности. В статье приведены результаты обработки в плазме высокочастотного и низкочастотного газового разряда в установке плазменной обработки MPC RF‑12 дисков оптических кристаллов и кассет твердотельных светодиодов. Оценено влияние параметров и режимов плазменной обработки, а именно мощности, времени и типа рабочего газа, на качество обработки. Показано, что плазменная обработка является мощным инструментом влияния на свойства поверхности оптических кристаллов, эффективна для удаления оксидных слоев металлов и безопасна для клеевых соединений кристаллов с основанием.
Introduction. A review of foreign publications on 3D printing methods shows the possibility of their application for the manufacture of printed circuit boards (PCBs), while demonstrating the growth of interest in this field. One of the available methods is fused deposition modeling, which can be used to form substrates with channels for traces. At present, the minimum channel width comprises 100 µm, which corresponds to the 5th class of PCB accuracy. However, there is no data on how to obtain such dimensions or on the magnitude of their deviation from the given nominal values.Aim. To determine the influence of such factors as nozzle diameter and the number of contours on the dimensional characteristics of PCBs (linear dimensions; trace channel width; trace spacing; via diameters).Materials and methods. To obtain linear models, a full factorial experiment was carried out. The influence of the following materials was evaluated – polylactide (PLA), acrylonitrile butadiene styrene (ABS) and glass-filled ABS; slicers – Ultimaker Cura and PrusaSlicer; 3D printers – Picaso 3D Designer Classic 2016 and Hercules Strong 2017; brass nozzle with diameters ∅0.2 and ∅0.4 mm. The possibility of using brass nozzles coated with chemical nickel for printing with glass-filled filaments was considered. The study was conducted using the facilities of the "Center for Additive Technologies" of Bauman Moscow State Technical University.Results. The possibility of manufacturing PCBs up to the 2nd and 3rd accuracy classes using nozzles with a diameter of ∅0.4 and ∅0.2 mm, respectively, was shown. It was found that galvanic deposition of chemical nickel on a ∅0.2 mm brass nozzle makes it possible to increase the PCB wearability when printing with glass-filled filaments. Recommendations are proposed for selecting an optimal combination of nozzle diameter and the number of contours.Conclusion. The conducted analysis of mathematical models shows the significance of such parameters as nozzle diameter and the number of contours. The results can be used when creating new PCB layouts
An experimental investigation of the structure and phase composition by X-ray, Raman, and ultrasoft X-ray emission spectroscopy, as well as the study of the electrical properties of WxSi(1-x) films used as sensitive elements of superconducting single-photon detectors (SNSPD), depending on the thickness in the range from 7 to 80 nm, was carried out, according to the results of which it was found that the W3Si phase is presumably formed in films 20 and 40 nm thick with a resistivity of 8.4 10-5 and 6.0 10-5 Ω cm, respectively, containing the WSi2, W5Si3, and SiO2 phases, as well as WOx and a small share of β-W. Films with a thickness of 7 nm have the highest resistivity of 18.0 10-5 Ω·cm and contain nanocrystals, WSi2, SiO2, as well as β-W, and an amorphous silicon phase. Films with a thickness of 80 nm (the resistivity is also 18.0 10-5 Ω·cm) predominantly contain WSi2, as well as W5Si3 and SiO2, and, presumably, the W3Si phase.
В работе описаны актуальные модели детектирования и текущее состояние развития техники однофотонных детекторов. Проведен анализ материалов изготовления ультратонких пленок для детекторов, структура которых создана на основе полосок микрометровой ширины (SMSPD), и составлены рекомендации для улучшения их рабочих характеристик. Для снижения скорости темнового счета (DCR), возрастания эффективности детектирования системы (SDE), быстродействия (CR) и увеличения активной площади необходимо использовать SMSPD из рентгеноаморфных материалов типа α-Mn с низким коэффициентом диффузии, обладающих топологией, созданной на основе брэгговских отражающих структур (DBR), с высоким коэффициентом заполнения и уширением полосы элементов на повороте.
Плазменная обработки является мощным инструментом для очистки поверхностей материалов от загрязнений, уменьшения шероховатости поверхности, повышения поверхностной энергии и модификации поверхности. Использование установок плазменной обработки в цепочке технологического оборудования является общемировой тенденций. В статье приведены результаты обработки в плазме высокочастотного газового разряда в установке плазменной обработки MPC RF‑12 стеклянных подложек, используемых в изделиях фотоники. Исследовано влияние параметров и режимов плазменной обработки, а именно мощности и времени, на качество обработки, определяемое углом смачивания. Показано, что в некоторых случаях можно достичь сходных результатов при разном соотношении параметров плазменной обработки.
An experimental investigation of the structure and phase composition by X-ray, Raman, and ultrasoft X-ray emission spectroscopy, as well as the study of the electrical properties of WxSi1-x films used as sensitive elements of superconducting single-photon detectors (SNSPD), depending on the thickness in the range from 7 to 80 nm, was carried out, according to the results of which it was found that the W3Si phase is presumably formed in films 20 and 40 nm thick with a resistivity of 8.4·10-5 and 6.0·10-5 Ω ·cm, respectively, containing the WSi2, W5Si3, and SiO2 phases, as well as WOx and a small share of β-W. Films with a thickness of 7 nm have the highest resistivity of 18.0·10-5 Ω ·cm and contain nanocrystals, WSi2, SiO2, as well as β-W, and an amorphous silicon phase. Films with a thickness of 80 nm (the resistivity is also 18.0·10-5 Ω ·cm) predominantly contain WSi2, as well as W5Si3 and SiO2, and, presumably, the W3Si phase. Keywords: Superconducting single-photon detector, phase composition, X-ray amorphous structure, WSi superconducting films, spectroscopy.
The relevance of magnetron sputtering to obtain conductive metallized coatings with a thickness of up to tens of micrometers is indicated. Attention is paid to the features of magnetron sputtering with a liquid target. It is noted that this process is currently being implemented using magnetrons with size from 3” to 6”. The design flaws of the existing NMSA-52M magnetron and its mounting unit to the chamber of the vacuum coating system MVTU-11-1MS are considered. The design of a magnetic system with an increased value of magnetic induction on a 2” magnetron surface has been developed. The magnetron sputtering source were designed: a housing, a chamber mounting unit and a cover. As a result, a variant of the improved design of the magnetron sputtering source is presented, which takes into account the disadvantages of the existing NMSA-52M magnetron.
The article considers the results of designing an automatic control system (ACS) for plasma processing unit Multi Plasma Cleaner One (MPC One). The appearance of the installation and its features are presented. The advantages of plasma treatment and its application areas are given. The analysis of existing plasma processing units is carried out and the need for automation of the MPC One installation is proved. Two gas lines are provided for physical and chemical cleaning. The designed automatic control system for the MPC One unit allows the operator to carry out plasma processing in automatic mode. The MPC One unit is equipped with high-frequency and low-frequency generators. The review of the sources of information on plasma processing of products is carried out, which justifies the advantages and areas of its application. The graphical interface was created, and the Python program was written for the MPC One automatic control system. MPC One unit uses well-established recipes. The article gives a description of the interface. Signals that manage the equipment (output signals) and monitor the process and equipment (input signals) are analyzed. The debugging stand and the interface to it were created for testing the software. Devices that check the operation of each of the processed signals were selected. ACS will eliminate operator errors and more effectively control the process.
В работе рассмотрена актуальность использования тонкопленочных датчиков различного назначения. Проведен анализ этапов для реализации технологии по созданию датчика. Обоснован выбор материалов элементов датчика. Экспериментальные исследования отражают появление проблем в характеристиках диэлектрических покрытий - низкого значения сопротивления. Рассмотрены и предложены методы борьбы с низким значением сопротивления диэлектрических покрытий.
В статье приводится обзор используемых в ведущих научных группах систем экранов квантовых схем. Выделены общие требования к построению таких систем и выявлены проблемы, связанные с большим разнообразием материалов и отсутствием методики их разработки.
The absorption efficiency, cutoff wavelength, and recovery time of a superconducting single-photon detector depending on sheet resistance Rs and critical temperature Tс of the WxSi1 – x film were calculated. The calculated dependences of the detector characteristics for the WxSi1 – x films show that the films with Tc > 3.5 K and 300 < Rs < 420 Ω/sq will provide ηabs ≈ 15–20% and ηIDE = 100% at a radiation wavelength of 1550 nm and a detector recovery time of τ < 40 ns, which corresponds to the possible detector count rate CRmax = 25 MHz.
The absorption efficiency, cut-off wavelength, and recovery time of a superconducting nanowire single-photon detector were calculated as functions of the surface resistance Rs and the critical temperature Tc of the WxSi1-x film. The calculated dependences for the SNSPD on WxSi1-x films show that films with Tc > 3.5 K and 300 < Rs < 420 Ω/sq will provide ηabs ≈ 15...20%, ηIDE = 100% at a wavelength of 1550 nm and the recovery time τ < 40 ns, which corresponds to the possible SNSPD count rate CRmax = 25 MHz.
В статье представлены современные применения и преимущества электронно-лучевой технологии в обработке стекла и керамических материалов. Рассмотрена конструкция и технологические возможности вакуумной установки «ЛУЧ» для электронно-лучевой плавки, сварки и размерной микрообработки электровакуумного стекла и керамических материалов, в том числе LTCC керамики.