In the companion article (Part I), simplified compact model of components in a system level model was established based on heat transfer path and thermal resistance network analysis. In this article, component level simulation and lead level simulation was conducted by assiging the boundary conditions from the data of the higher level simulation, and effects of different boundary conditions on numerical accuracy and stability are studied. Comparison shows that multiscale thermal modeling methodology can save 87% of the total computation time compared with full simulation with a fine grid system, and can greatly improve the resolution of the calculation result. Mainly based on the multiscale simulation five improvements for the reduction of the maximum PCB temperature are proposed. This article also provides an example that by a careful numerical thermal design, a passive cooling mode can sometimes meet …

通过改进太阳罩结构,改变PCB安装形式,设置隔热等方式,对大功率PCB在大空间极限热环境下的散热方式进行了优化和数值模拟.研究结果表明,根据不同发热电子元件的功率及其在PCB上的安装位置及与PCB的连接形式,采用上述措施,可以显著改善散热效果.