This paper demonstrates a novel RFCMOS process monitoring test structure. Outstanding agreement in dc and radio frequency (RF) characteristics has been observed between conventional test structure and the new process monitoring test structure for MOSFET with good correlations in measured capacitances also noted for metal-insulator-metal capacitor and MOS varactor. Possible process monitoring test structure is also suggested as a reference benchmarking indicator for interconnects.

A novel RFCMOS process monitoring test structure has been proposed for the first time in this paper. Excellent agreement in DC and RF characteristics has been observed between conventional test structures and the new process monitoring test structure for both n and p MOSFETs of different device dimensions. This new layout approach can be extended to other devices such as MIM capacitors, diodes, MOS varactors and interconnects.