We present a high-heat-flux cooling device for advanced thermal management of electronics. The device incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation. The underlying concept takes advantage of the capillary pressure generated by small pores in the membrane, and minimizes the viscous loss by reducing the membrane thickness. The heat transfer and fluid flow in the device were modeled to determine the effect of different geometric parameters. With the optimization of various parameters, the device can achieve a heat transfer coefficient in excess of 0.05 kW/cm2-K, while dissipating a heat flux of 1 kW/cm2. When applied to power electronics, such as GaN high-electron-mobility transistors, this membrane-based evaporative cooling device can lower the near-junction temperature by more than 40 K compared with contemporary single-phase microchannel coolers.

We present a 75km-reach 100Gb/s DWDM transmitter based on a fully passive, hybrid assembly of a 10x10Gb/s laser array with a low-loss SiO2 AWG, and its optimization for thermal management, low cost and high yield.

Compact parallel transmitters and receivers with an aggregate capacity of 107 Gb/s are built through hybrid integration of arrays of ten 100-GHz spaced directly modulated lasers, arrays of ten avalanche photodiodes, and high-index contrast silica arrayed waveguide grating multi- and demultiplexers. Unamplified transmission over 75 km of standard single-mode fiber and 155-km amplified links is demonstrated in the C-band, by using a modulation format based on spectral offset filtering and electronic dispersion compensation.

In order to meet the demand for X-ray lenses with large apertures and, hence, photon flux, a new type of Xray lenses has been developed: Rolled prismatic X-ray lenses feature a vast number of refracting surfaces to increase transparency and aperture, respectively. Prototypes of such lenses have been fabricated by molding and rolling of a structured polyimide film. In this work, rolled prismatic X-ray lenses are pictured, and results of first tests performed at the ANKA storage ring in Karlsruhe are presented.

Infrared imaging spans a wide range of wavelengths, underlying technologies, and applications. Advancements in cost reduction and performance have the potential for opening up new markets, for both military and consumer applications. Micromachining and wafer fabrication technologies are critical for the production of infrared (IR) sensor arrays. This paper investigates ways in which micro-electro-mechanical systems (MEMS) design experience can be applied to uncooled IR imaging in the areas of direct view and multispectral sensor technology. © 2009 Alcatel-Lucent.

A cantilever-based uncooled IR imager was developed utilizing a novel optical readout scheme based on inter-pixel interference. A series of small arrays (approximately 100×100 pixels) were fabricated using 8-in. silicon MEMS processes. The array design and process development will be discussed and initial uniformity and imaging results presented. Future challenges in developing a direct-view IR imager will be addressed.