Trapped ions provide a high-fidelity platform for quantum information processing, yet delivery of multiple, distinct wavelengths across large networks of interaction zones remains a bottleneck. Conventional free-space light delivery lacks scalability, while on-chip grating couplers suffer from narrow operational bandwidth that increases circuit footprint and optical interfacing complexity. Here we show a broadband photonic integrated circuit capable of addressing individual ions. The circuit combines a planar waveguide lens with a micromirror fabricated using two-photon polymerization at wafer scale. This implementation can address three individual ions from λ = 405 - 880 nm with -27 dB average intensity crosstalk at 5 μm pitch. We trap ^40Ca^+ and ^138Ba^+ ions above such devices, characterize optical crosstalk with barium ions, and demonstrate individual repumping of calcium ions. This monolithic photonic architecture brings broadband addressing in an on-chip modality to trapped-ion technology. More generally, integrating additive manufacturing into quantum devices is poised to unlock expanded design space for implementing novel quantum architectures.

We develop a wafer-scale SiON process for all-dielectric integrated microlens couplers, enabling efficient, broadband, polarization-insensitive, and environmentally robust fiber-to-chip coupling with 1.0 dB measured loss.

This study demonstrates the concept to monolithically integrate piezoelectric actuated structures of different natural frequencies on an SOI wafer to achieve the full-range MEMS speaker array. First of the two major points featured in this research is leveraging the characteristic of micromachining technology to design, fabricate, and integrate multiple PZT actuation units on a single chip to enhance the performance of microspeaker. The second is the design of novel driving electrodes on two bridge structures and one clamped diaphragm (5 mm by 1.5 mm) activating different resonant modes to increase SPL (Sound Pressure Level) at low, medium and high frequencies. As a result, the full-range MEMS speaker array can be realized. Measurements in the standard ear simulator illustrate that with 3.5 V rms driving voltage, the proposed microspeaker has SPL higher than 81dB in the full audio range, and even larger than 90 dB from 60 Hz to 15 kHz.

This study designs and implements the piezoelectric MEMS scanning mirror with large scan angle and reflection area for light beam manipulating applications. In this design, the scanning mirror has a large mirror plate (3 mm in diameter) supported by two T-shape torsional springs. The U-shape piezoelectric cantilever acts as the actuator to drive the scanning mirror through the transmission spring. The analytical model is established to provide the design guideline of transmission spring to increase the scan angle. In application, the proposed designs are fabricated on the SOI (silicon on insulator) wafer deposited with the PZT film. Measurements indicate the fabricated mirror could reach an optical scan angle of 140-degree (mechanical scan angle of +/- 35-degree) when driving at its resonant frequency of 1.5 kHz with a unipolar driving voltage of 42 V. Moreover, no vacuum environment is required for the presented scanning mirror to achieve the above scan angle. This is an extremely large optical scan angle for the MEMS scanner with a mirror plate of 3 mm in diameter. In addition, another U -shape piezoelectric cantilever serves as the position sensor to detect the scan angle of mirror plate. The sensing signals show good linearity with the scan angles and can be exploited as the feedback control. Measurements also demonstrate that the micro scanner could withstand 1500 g shock loading, and the deviation of scan angle is less than 10% after the cycling test under 10 Vpp resonant driving in 95%RH and room temperature for 0.2 billion cycles.

This study presents the design, implementation, and characterization of 1D resonant type micro-electro-mechanical-systems (MEMS) piezoelectric scanning mirrors with different actuator designs to investigate their influences on the figure of merits (FoMs) for automotive light detection and ranging application. The MEMS scanning mirrors are driven by lead zirconate titanate (PZT) thin film in this study owing to its outstanding piezoelectric properties. Three different beam-type piezoelectric actuators are designed, including the reference meander straight-beam actuator design, and the proposed meander curved-beam and straight-curved tapered beam actuator designs. Simulations show the scan angle enhancement for two proposed designs, yet the resonant scanning frequency of meander curved-beam design dropped to below the 2 kHz requirement. To evaluate the designs, scanning mirrors with two proposed actuators are fabricated and tested. Measurements show that the resonant frequencies for the two proposed MEMS scanning mirrors are 1735 Hz and 2578 Hz, respectively. Two proposed designs respectively have the maximum optical angles of 48.1° and 50.6° at the 20 V pp driving voltage. Due to the much higher stress on the beam structure induced by the misalignment of PZT film, the actuator could not reach the predicted scanning angle of near 80°. In comparison of the two proposed designs, the straight-curved tapered beam actuator design could enhance the FoM for about 56%. In summary, the performances of piezoelectric MEMS scanning mirror can be improved by varying the designs of length and shape of actuator, and the distribution of PZT film on the suspended actuator is also a critical design concern.

This study presents a novel piezoelectric thin film driven bi-axial MEMS scanning mirror in Fig. 1. Design features of the proposed device include: (1) Tri-gimbal structure (Fig. 1a-b): by exploiting the middle-gimbal structure to prevent the coupling of the modes in two orthogonal axes so as to achieve straight edges of scanning pattern; (2) Curve-tapered actuators with desired electrodes distribution and routing (Fig. 1c-d): to act as the torque generator on torsional-spring to enlarge the scan angle and also restrain the unwanted plate modes. The miniaturized scanner with mirror of 1.2mm diameter was realized in 6×6mm 2 chip size. Under resonant driving (no vacuum required), the presented scanner has 59.7° horizontal scanning angle at 6.5kHz and 7.8° vertical scanning angle at 16kHz. The 2-axis scanning pattern has straight edges showing good decoupling of the middle-gimbal design.

Due to the fact that current deep learning models are typically driven by big data, existing interpretation models for emergency management lack relevant learning data. However, existing pre-trained image generative models cannot directly generate post-disaster remote sensing images without fine-tuning. In this paper, we demonstrate the ability of natural language guidance synthesizing remote sensing imagery affected by disaster by pre-trained image generative model fine-tuned with very few unlabelled images (i.e., less than 100 fine-tuning images) at very low training cost (i.e., one 2080Ti GPU). To trade for lower cost, we embrace the trend of large model, leveraging a pre-trained caption model, GPT-4 and a pre-trained text-to-image Stable Diffusion model for this task. The Stable Diffusion Model, fine-tuned with our method, successfully synthesizes remote sensing images affected by disasters using natural language guidance in both image inpainting and image generation tasks. In addition, the ground truth for other interpretation models learning. With this achievement, our method can synthesize a large amount of data for the emergency management interpretation model to learn when there is less existing data, only unlabelled data and less time, so as to achieve better interpretation performance. Furthermore, our approach highlights the significant of combining human feedback with large models in synthesizing data which is out of the prior knowledge of large model, especially when there is less data available and less computational power available.

Owing to its excellent performance at high temperatures, the Inconel713C casting superalloy has been exten-sively used as a functional and structural material in the aviation and energy industries. Many Inconel713C superalloy components have to be manufactured by welding technologies, but joint cracks are often induced by fusion welding, deteriorating the performance of the components. Here, a modified Inconel713C casting su-peralloy joint without cracks was obtained using electron beam feeding wire welding with the Inconel718 alloy as the filler. The tensile strength of the joint reached 1070 MPa, exceeding that of the base metal (722 MPa) by 32.5 %. Smaller-size grains, smaller gamma ' phase, and larger gamma ' phase volume fraction were obtained by controlling the chemical composition and heat input of the welds. The microstructure of the fusion zone comprised den-drites, including a large number of gamma ' phases (approximate size, 18 nm) and carbides (approximate size, 2 mu m) distributed in the gamma matrix. The microhardness of the fusion zone (approximately 420 HV) exceeded that of the base metal (approximately 370 HV), with no obvious softening in the heat-affected zone.

We design and experimentally demonstrate a new silicon photonic fiber coupling method using integrated microlens couplers. Efficient and broadband coupling to a single mode fiber with a best coupling loss of 0.9 dB is achieved.

This study presents a novel butterfly-plate piezoelectric actuator to drive MEMS micro-mirror with decent scanning angle and frequency at low voltage. The micro-mirror is driven by four butterfly-plate actuators around the mirror plate. Merits of this study are, (1) butterfly-plate actuators with dual driving electrodes: butterfly-plate actuator has larger PZT area (than cantilever actuator) to contribute higher driving force, and the round corner on butterfly-plate is to remove the structure with larger bending caused by residual stress. The dual driving electrodes is exploited to further enhance the output displacement. (2) boundary of actuator: the proposed boundary condition of actuators could reduce the constraint of butterfly-plate to enhance its output displacement. Measurements demonstrate the proposed micro-mirror has 38-degree scanning angle with scanning frequency of 25.5 kHz when driving at 12 V pp .

This study designs and realizes a piezoelectric MEMS scanning mirror with large scan angle and high frequency for high-resolution laser beam scanning displays. In Fig. 1 a, this design has three merits: (1) wing-shaped actuators: to serve as the pure torque generator to drive the torsional spring and mirror (1.2mm) with good linearity (since no axial/transverse loads), (2) wing-shaped actuators: to localize the energy at torsional-spring and mirror to achieve large scan angle (at the scanning mode); (3) optimal supporting spring: to suppress the mode coupling and further to lower the stress during scanning. Thus, large scan angle at high scanning frequency is achieved. Measurements demonstrate the scanner has an optical scan angle of 70-degree (mechanical scan angle of ±17.5-degree) at the resonant frequency of 37.7kHz (no vacuum required), which can reach target resolution 1080P, with a unipolar driving voltage of 20V. As summarized in Fig. 7, compared with existing scanners, the performance of the presented one is competitive in FOM (optical scan angle (θ) × mirror size (D)) when driving at resonant frequency.

Three-dimensional (3D) imaging sensors allow machines to perceive, map and interact with the surrounding world 1 . The size of light detection and ranging (LiDAR) devices is often limited by mechanical scanners. Focal plane array-based 3D sensors are promising candidates for solid-state LiDARs because they allow electronic scanning without mechanical moving parts. However, their resolutions have been limited to 512 pixels or smaller 2 . In this paper, we report on a 16,384-pixel LiDAR with a wide field of view (FoV, 70° × 70°), a fine addressing resolution (0.6° × 0.6°), a narrow beam divergence (0.050° × 0.049°) and a random-access beam addressing with sub-MHz operation speed. The 128 × 128-element focal plane switch array (FPSA) of grating antennas and microelectromechanical systems (MEMS)-actuated optical switches are monolithically integrated on a 10 × 11-mm 2 silicon photonic chip, where a 128 × 96 subarray is wire bonded and tested in experiments. 3D imaging with a distance resolution of 1.7 cm is achieved with frequency-modulated continuous-wave (FMCW) ranging in monostatic configuration. The FPSA can be mass-produced in complementary metal–oxide–semiconductor (CMOS) foundries, which will allow ubiquitous 3D sensors for use in autonomous cars, drones, robots and smartphones.

Photonic delay-based reservoircomputers (RC) have emerged as an attractive high-speed, low-power alternative to traditional digital hardware for AI. We demonstrate experimentally a novel hybrid RC scheme in which input data is first preprocessed through several convolutional layers, either trained or untrained, digitally to generate novel feature maps. These random feature maps are then processed through an optoelectronic implementation of delay-based RC. Using the MNIST dataset of handwritten digits, experiments of our proposed hybrid scheme achieve classification error of 1.6% using untrained convolutions, and an error of 1.1% using trained convolutions, results comparable to that of state-of-the-art machine learning algorithms. Additionally, our experimental implementation can offer a potential 10x decrease in model training time, compared to that of common digital alternatives.

The rapid development of micromanipulation technologies has opened exciting new opportunities for the actuation, selection and assembly of a variety of non-biological and biological nano/micro-objects for applications ranging from microfabrication, cell analysis, tissue engineering, biochemical sensing, to nano/micro-machines. To date, a variety of precise, flexible and high-throughput manipulation techniques have been developed based on different physical fields. Among them, optoelectronic tweezers (OET) is a state-of-art technique that combines light stimuli with electric field together by leveraging the photoconductive effect of semiconductor materials. Herein, the behavior of micro-objects can be directly controlled by inducing the change of electric fields on demand in an optical manner. Relying on this light-induced electrokinetic effect, OET offers tremendous advantages in micromanipulation such as programmability, flexibility, versatility, high-throughput and ease of integration with other characterization systems, thus showing impressive performance compared to those of many other manipulation techniques. A lot of research on OET have been reported in recent years and the technology has developed rapidly in various fields of science and engineering. This work provides a comprehensive review of the OET technology, including its working mechanisms, experimental setups, applications in non-biological and biological scenarios, technology commercialization and future perspectives.

Dielectrics with improved energy density have long-standing demand for miniature and lightweight energy storage capacitors for electrical and electronic systems. Recently, polyvinylidene fluoride (PVDF)-based ferroelectric polymers have shown attractive energy storage performance, such as high dielectric permittivity and high breakdown strength, and are regarded as one of the most promising candidates. However, the non-negligible energy loss and inferior temperature stability of PVDF-based polymers deteriorated the energy storage performance or even the thermal runaway, which could be ascribed to vulnerable amorphous regions at elevated temperatures. Herein, a new strategy was proposed to achieve high energy density and high temperature stability simultaneously of PVDF/PMMA blends by in situ polymerization. The rigidity of the amorphous region was ideally strengthened by in situ polymerization of methyl methacrylate (MMA) monomers in a PVDF matrix to obtain PVDF/PMMA blends. The atomic force microscopic study of the microstructure of etched films showed the ultra-homogenous distribution of PMMA with high glass transition temperature in the PVDF matrix. Consequently, the temperature variation was remarkably decreased, while the high polarization response was maintained. Accordingly, the high energy density of ∼8 J/cm 3 with ∼80% efficiency was achieved between 30 and 90 °C in PVDF/PMMA films with 39–62% PMMA content, outperforming most of the dielectric polymers. Our work could provide a general solution to substantially optimize the temperature stability of dielectric polymers for energy storage applications and other associated functions.

A scalable beam steering device is proposed for control of ion trap quantum computers. A combination of a waveguide array and a two-dimensional focusing grating coupler is used to generate 8xN beam spots at 729 nm wavelength in free space.

Deflectometric slope profiler is an essential technique for accessing the surface metrology of mirrors used in synchrotron radiation beamlines. To increase the upper spatial frequency bandwidth limits of deflectometric slope profiler, reducing the beam spot size on the mirrors is necessary. In this paper, we introduce a profiler system: the focusing long trace profiler (FLTP). It contains a newly developed optical head capable of raising upper spatial frequency bandwidth limits by using a focused beam instead of a collimated beam to scan the sample. This feature has been proven in a numerical simulation experiment, where a spatial resolution of up to around 0.05 mm was reached when the sample is set at focus plane. The system is implemented and characterized in several experiments; calibration of the focusing optical head shows that it can achieve a high angular accuracy of sub-50 nrad root-mean-square (rms) and defocusing of sample under test (SUT) has no effect on the measurement results; the measurement tests also demonstrate the system's advantage in highly curved mirror profile metrology.

This article presents a frequency interleaved technique (FIT) that can be applied to add resonant peaks in the response of distributed amplifier (DA) for loss compensation and then a frequency-interleaved distributed amplifier (FIDA) that can achieve a high-gain and wide-bandwidth frequency response by summing multiple overlapping distinct-band frequency responses through a distributed configuration. A detailed discussion was introduced to verify the FIDA and a DA was implemented using the FIT. The reported 65-nm CMOS FIDA chip occupies an area of $0.9\times 0.95\,\,\text {mm}^{2}$ and achieves a 17.2 dB small-signal power gain, 2–68 GHz −3-dB bandwidth, gain bandwidth product (GBW) of 478 GHz, and gain ripple of less than 2 dB, while consuming 120 mW under 1.2 V.

Unsupervised domain adaptation is to transfer knowledge from a well-annotated source domain and learn an accurate classifier for an unlabeled target domain, which is particularly useful in multimodal medical image processing. Currently available adaptation approaches strongly reduce the domain bias or inconsistency in the latent space, deteriorating inherent data structures. To appropriately leverage the reduction of the domain discrepancy and the maintenance of the intrinsic structure, this paper proposes a dual U-DenseTransformer generation domain adaptation framework to bridge the gap between source and target domains and achieve translation. Specifically, we create a DenseTransformer with multi-head attention embedded in U-shape network to establish a dual-generator strategy, which is further enhanced by a new hybrid loss function and an edge-aware mechanism that preserve inherent data structure consistent. We apply our proposed method to medical image segmentation, with the experimental results showing that it works more effective and stable than currently available approaches. Particularly, the dice similarity was improved from 79.3% to 82.8%, while the average symmetric surface distance was reduced from 2.5 to 1.9.

We report on $32\times 32$ silicon photonic switches realized through wafer bonding. Broadband operation is demonstrated over 1260-1320 nm range. The maximum on-chip loss is measured to be 4 dB and the cross-talk is −80 dB. © 2022 The Author(s)