The study aimed to investigate the underlying physics limiting the temperature stability and performance of non-surface passivated Al0.34Ga0.66N/GaN Hall effect sensors, including contacts, under atmospheric conditions. The results obtained from analyzing the microstructural evolution in the Al0.34Ga0.66N/GaN Hall sensor heterostructure were found to correlate with the electrical performance of the Hall effect sensor. High-resolution x-ray photoelectron spectroscopy studies revealed the signature of surface oxidation in the GaN cap layer, as well as a slight out-diffusion of “Al” from the AlGaN barrier layer. To prevent the formation of a bumpy surface morphology at the Ohmic contact, we investigated the impact of “Pt” top Ohmic contacts. The application of a top “Pt” contact stack resulted in a smooth Ohmic contact surface and provided evidence that the bumpy surface morphology in Au-based Ohmic contacts is due to the formation of an Al-Au viscous alloy during rapid thermal annealing. In the early stages of thermal aging, the small drop in contact resistivity stabilized with subsequent thermal aging past the initial 550 h at 200 °C. The outcome is that the Al0.34Ga0.66N/GaN Hall effect sensors, even without surface passivation, exhibited a stable response to applied magnetic fields with no sign of significant degradation after 2800 h of thermal aging at 200 °C under atmospheric conditions. This observed stability in the Hall sensor without surface passivation can be attributed to a self-imposed surface oxidation of the cap layer during the early stages of aging, which serves as a protective layer for the device during subsequent extended periods of thermal aging at 200 °C.

SiC is an indirect bandgap semiconductor with material properties ideal for power electronics but not so much as an optical emitter. Meanwhile, gallium arsenide (GaAs) is a material known for high-performance optical devices due to its direct bandgap and carrier lifetime. Integrating GaAs with silicon carbide (SiC) can result in the best of both materials. However, integrating the two presents a significant challenge due to the large lattice mismatch between the two materials. In this paper, we investigate the growth of high-quality GaAs directly on 4H-SiC and on AlAs/4H-SiC substrates. The thin films were characterized using key techniques for structural and optical analyses, such as x-ray diffraction, atomic force microscopy, and photoluminescence (PL) spectroscopy. The 3D-island nature of growth of GaAs directly on SiC results in weak in-plane correlation with the substrate but high photoluminescence. This was demonstrated with an observed PL intensity comparable to the PL observed from a GaAs substrate with a similar buffer layer. Introduction of a thin AlAs nucleation layer results in improved wetting of the substrate, better in-plane correlation with substrate, and overall improved crystalline quality and is now under further study.

Chemical short-range order (SRO) in alloys denotes the statistical preference or avoidance between atomic species on neighboring lattice sites. Here, we highlight SRO as a powerful new mechanism for semiconductor alloy band engineering. Atom probe tomography reveals a significantly higher probability of Sn-Sn first nearest neighbors (1NNs) in thin-film GeSn alloys grown by molecular beam epitaxy (MBE) vs. chemical vapor deposition (CVD). Remarkably, although lower Sn concentration typically widens the bandgap, we find that the stronger presence of Sn-Sn 1NN pairs in MBE samples overrides this trend, resulting in a narrower bandgap despite having 2 at.% lower Sn content than CVD samples. First-principles modeling corroborates this effect, attributing these SRO variations to distinctive surface terminations and growth temperatures between MBE and CVD. These findings establish SRO as a new degree of freedom for semiconductor band engineering beyond composition, strain, and quantum confinement, unlocking novel device mechanisms for the post-Moore era.

High-quality InN has significant opportunities for exciting and impactful electronic and photonic applications. These applications rely on growth techniques that produce high-quality InN thin films. To achieve the fabrication of InN semiconductor thin films with a low density of misfit and threading dislocations, we report on a growth technique that utilizes composition and strain gradients to limit the propagation of defects into InN grown on a GaN/sapphire substrate. The growth technique we have investigated utilizes a compressively strained gradient transition layer to limit the propagation of threading dislocations from the GaN buffer. Reflection high-energy electron diffraction, high-resolution X-ray diffraction, Raman spectroscopy, photoluminescence, and Hall measurements were employed to evaluate the effectiveness of the gradient transition layer to improve the quality of InN thin films. The outcome is that for InN films grown on partially graded InxGa1-xN(x -> 0 to 29%), when compared with InN grown directly on a GaN substrate, we observed about a 40% decrease in edge dislocations, a 50% increase in photoluminescence, and a 20% increase in mobility. When compared to a sharp strain boundary, a linear strain gradient offers threading dislocations the opportunity to reduce the energy of the system more by leaving the system than by propagating into the strained region.

We investigated the process of Sn incorporation and surface segregation for compositionally graded Ge1-xSnx epilayers grown on high-quality Ge (001) substrates. The growth resulted in pseudomorphic GeSn layers with a similar to 6% maximal Sn fraction at a constant substrate temperature. The maximal fraction of Sn was increased to 9.0% when the growth temperature was continuously lowered while increasing the Sn flux. The analysis of surface droplets and SIMS profiles of elemental composition give evidence of Sn rejection during the growth, potentially associated with a critical energy of elastic strain. The intentional reduction of the coherent strain by decreasing the Sn flux near the sample surface has been shown to trap a higher fraction of Sn in the Ge1-xSnx layer and lower surface segregation. Our results demonstrate that strain relief by misfit dislocations in the compositionally graded layer is inhibited, which leads to Sn segregation. Specifically, the compressive strain in the graded Ge1-xSnx epilayer is effectively "zero" near the interface with the Ge substrate and increases up to about -1.5 x 10(-2) near the surface. Thus, although the nucleation of a dislocation may reduce the compressive strain for the top region of the epilayer, it is not beneficial for the bottom region.

We investigated the thermal stability and performance of AlGaN/AlN/GaN Hall-effect sensors under industry-relevant atmospheric conditions. The thermal stability and performance of Hall sensors are evaluated by monitoring Hall sensitivity, two-dimensional electron gas density, and Ohmic contact resistance during aging at 200 °C for up to 2800 h under atmospheric conditions. This was accomplished by characterizing AlGaN/AlN/GaN micro-Hall sensors, with and without contacts, and before and after being placed under different thermal aging times. Observed electrical performance was correlated with the micro-structural evolution of AlGaN/AlN/GaN Hall sensor heterostructures. Results indicate that the AlGaN/AlN/GaN Hall sensor provides stable performance for as long as 2800 h aging at 200 °C without any significant degradation of (i) Hall sensitivity, (ii) two-dimensional electron gas, and (iii) Ohmic contacts. However, there was a small change in sheet density and mobility, which is due to a decrease in polarization, resulting from local inhomogeneous strain relief at the barrier layer. During the early stage of thermal aging, a decrease in contact resistance was also observed and attributed to (i) out-diffusion of “Ga” at the vicinity of the contact interface, and (ii) a reduction in oxygen concentration and formation of Al–Ti intermediate alloy at the GaN/Ti interface, resulting in a reduced barrier and enhanced electron transport at the contacts. However, despite these small changes, results indicate that the AlGaN/AlN/GaN Hall sensor provides stable performance for as long as 2800 h thermal aging at 200 °C.