Ceramic substrates in power electronic modules provide several functions such as electrical insulation, thermal conduction, and mechanical support. Aluminum Oxide $\left(\mathbf{A l}_{\mathbf{2}} \mathbf{O}_{\mathbf{3}}\right)$, Aluminum Nitride (AIN), and Silicon Nitride $\left(\mathbf{S i}_{\mathbf{3}} \mathbf{N}_{\mathbf{4}}\right)$ are among the widely used substrates in power electronic modules. Nowadays, the design of functionalized ceramic substrates including different types of ceramics and metallization is possible thanks to Spark Plasma Sintering (SPS) or Additive Manufacturing (AM). In this regard, this paper presents an experimental study on the electrical breakdown strength of $\mathbf{A l}_{\mathbf{2}} \mathbf{O}_{\mathbf{3}}$ obtained by SPS and AM. The electrical breakdown tests are performed under DC voltage stress. A comparative analysis of breakdown field strength obtained for both types of $\mathbf{A l}_{\mathbf{2}} \mathbf{O}_{\mathbf{3}}$, SPS and AM, is presented. A potential use of these ceramics for power module substrate design is discussed.

The demand for compact and efficient power electronic devices, particularly in rail transport and aeronautics, drives the development of high-power modules capable of handling higher levels of voltages (>1 kV) and currents (>100 A). Advances in semiconductor technology, particularly the shift from silicon (Si) to silicon carbide (SiC) chips, introduce more challenges for packaging design. Thus, it highlights the increasing need to integrate decoupling capacitors into the power electronic module. Integrating a capacitor close to the switching device is desirable, as it improves the switching performance. Nevertheless, capacitor integration is a challenge to overcome. Consequently, optimized and functionalized packages are required to support this integration into the ceramic substrate of power electronic modules. Ceramic capacitors are promising candidates for this integration due to their inherently rigid mechanical structure. This article aims to describe the constraints and requirements for capacitor material integration, with a particular focus on dielectric characteristics and electrical breakdown field strength. The electrical properties of undoped barium titanate (BaTiO3) shaped by spark plasma sintering (SPS) in correlation with the elaboration process are discussed. Finally, the potential for integration into power electronic modules is assessed.

This study deals with the development of a wide-frequency-band characterization for failure analysis of power modules, focusing on a specific IGBT packaging. It is highlighted that different characteristics of the IGBT and the packaging can be distinguished depending on the frequency band analyzed, enabling the detection of potential failure modes. Particularly, for the power bond-wire lift-off mechanism, the paper emphasizes the importance of considering high-frequency analysis above 200 MHz. It is enabled through the definition of a failure indicator, demonstrating the ability to highlight partial failures as well as to localize them.

Multi-level converters represent an alternative to conventional two-level topologies for high-voltage and high-power applications. In this article, the improved design of a power module for these architectures is considered. To this end, different series multilevel topologies are compared in terms of performance for a specific operating point. The analysis includes criteria such as loss distribution, switch temperatures and the impact of modulation strategies. These results, which are preliminary to the design process, can be used to guide the choice of architecture according to the needs of a specific application.

This paper introduces a novel measurement technique for 4-pin SiC MOSFET transistors with TO-247-4 packaging, accounting for mutual inductances and utilizing a two-port vector network analyzer (VNA). The proposed method involves six distinct measurements to obtain a 4x4 S-parameter matrix, which is subsequently reduced by implementing a "virtual ground" in Advanced Design System (ADS) to achieve optimal grounding for one of the transistor's pins. This approach ensures ideal grounding conditions for accurate measurements and allows ease of power and driver gate inductance loops extraction. Additionally, the paper details the RLC extraction process of the evaluated SiC transistor and compares the extracted capacitance values with those specified in the datasheet.

To enhance the efficiency of power modules, the development of new substrate technologies is essential. This article describes the design of a nickel-alumina substrate produced through co-sintering via spark plasma sintering (SPS), utilizing a sacrificial alumina layer approach. An Ni-Al2O3 substrate is achieved after sintering at 1150 degrees C under a pressure of 50 MPa. The substrate has two thick nickel metal layers, making it suitable for applications with high current densities. A well-defined interface, of thickness 30-40 mu m, is formed. It consists solely of pure nickel and pure alumina with no secondary phases. The mechanism behind the formation of this interface is attributed to thermomechanical deformation during the sintering process. Mechanical tests, including shear and pull tests, demonstrate adhesion strength that meets aeronautical standards. This one-step approach, which saves both energy and time, can be applied across various fields utilizing technical ceramics.

The miniaturization of power electronic devices is pushing manufacturers to improve the multifunctionality of components. Obtaining new materials with heterogeneous electrical properties is a challenge. In this work, the objective is to prepare, in a single step processing, a ceramic capacitor, including a thick metallization. This device will be a first step toward its integration in a power module. The assembly of a metal and ceramics is a challenge due to the difference of properties of these materials. A newBaTiO(3)-Ni functionally graded material (FGM) has been obtained by spark plasma sintering (SPS) co-sintering. The processing parameters of the BaTiO3-Ni FGM are optimized to target highly dense material with controlled microstructure. In this case, a crack free device is obtained with controlled dielectric properties and can be integrated in a power module device. The processing leading to the fabrication of this FGM in one step can be used for other components in power electronics applications.

DC voltage decoupling across a switching halfbridge has attracted significant attention, particularly with the adoption of GaN HEMT transistors, whose high switching speed exacerbates voltage overshoot and ringing. A design approach based on a cascade (chain) of decoupling capacitors is proposed to address the latter challenge. Counter-intuitively, DC voltage decoupling improves when specific capacitors are associated in a succession of filters. This paper presents the theoretical analysis of the proposed configuration, followed by experimental validation using a double-pulse testbench. The results confirm the positive impact on transistor switching performance of the decoupling capacitor arrangement.

This study deals with the integration of Rogowski sensor into power module using 3D printing for the coil former and the custom-designed casing. The sensor design is done considering the fundamental constraints of Rogowski sensors and specific integration requirements. The sensor fabrication process is described, and performance tests are presented. Finally, measurements taken on a double-pulse test bench are discussed, highlighting the designed sensor ability to measure currents into medium/high power modules on wide frequency bandwidth.

The present study is related to the compactness issues of power electronic modules and the integration of functions within their assemblies. It focuses on the dielectric properties of titanate-based ceramic material shaped by Spark Plasma Sintering. With such a process, barium titanate dense ceramic demonstrates high relative permittivity with low dielectric losses, presenting a particular interest for being an embedded decoupling capacitor. The aim of this work is to characterize the influence of different parameters, such as ceramic pellets’ thickness, densification, and permittivity on their breakdown strength under DC voltage stress.

Sustainability in power electronics is a recent research topic. It takes place among current actions to grasp design choices that enable eco-design and circular economy in the domain. This paper shows the results and analysis of a literature review at the intersection of power electronics and sustainability without considering the reliability study of the power electronics systems. The first part explains the scope of the study. The second part shows a bibliometric analysis of the collected publications that underlines a pioneering position at the European level. The third part details the state-of-the-art and its analysis over four investigation topics which are: tools and methods, indicators, circularity and materials. This paper and the work behind are the results of collaboration at the French national level, as part of the workgroup CEPPS (Convertisseurs Electronique de Puissance Plus Soutenables—More Sustainable Power Electronics Converters) supported by the CNRS (Centre National de la Recherche Scientifique—French National Centre for Scientific Research) research group SEEDS (Systèmes d’énergie électrique dans leurs dimensions sociétales—Societal dimensions of electrical energy systems).

Nowadays, the integration of power electronics into power systems has increased significantly. As a result, power grids were subject to numerous transformations. Hence, operations, power factor corrections, and voltage control of the grid-connected converters have become challenging tasks subject to enhancing the stability, reliability, and performance of the power grid. For this, we propose in this paper an advanced state-feedback control using the linear quadratic regulator (LQR) optimized by the metaheuristic method for a 2-level 3-phase voltage source converter (VSC) connected to the utility grid through an output L-type or LCL-type filter. The proposed methodology avoids the empirical trial-and-error technique for adjusting the weighting values of matrices Q and R respecting multi-objectives: (i) minimize control loop errors, (ii) minimize the overshoot, and (iii) respect suitable time constant. Thus, the optimal weighting matrices are provided using the multi-objectives Tunicate Swarm Algorithm-TSA. The effectiveness of the proposed methodology is tested on Electromagnetic Transients (EMT) VSC grid-connected systems and compared to standard vector control and advanced control (H-infinity). The proposed methodology permits important performance regulation of reactive power for the feasible VSC operation range and under perturbation conditions (short circuits,...).

This paper introduces a dynamic Pulse Width Modulation scheme, apply to N-level Flying Capacitor inverter. A mathematical approach is detailed to solve the expression of a linear system that model the inverter leg considered. Some degrees of freedom, that have to be set, are exhibited. The proposed technique relies on the relationship made between the degrees of freedom and the voltage unbalance of the floating capacitors. Simulation results are provided to illustrate the performance of such a modulation scheme.

This paper is intended to quantify the impact of several parameters related to two full-bridge inverters connected to the same DC bus on the harmonic content of the DC link current. The presented simulations suggest that the DC current distortion factor is impacted by the PWM scheme choices, by the carriers phase shift, by the load current phase shift and frequencies.

Reliability is at the heart of any system to function efficiently. Besides having a great development in the field of power electronic semiconductors, there is still a question of existing challenges. One of the significant challenges that needs great attention is state of damage prediction as it impacts the efficiency and reliability (lifetime) of the system. Therefore, the study's objective is to implement a new non-destructive testing method to detect the failure mechanisms and predict their influence. To illustrate, the Direct bonded copper ceramic substrates, namely Si3N4 with clip bonds undergo passive cycling test. As a result, they experience aging of brazing followed by clip failure examined by S–parameter transmitted and reflected waves.

This paper presents a modeling and simulating methodology of transient phenomena in power converters for a large frequency bandwidth. The system under study considers parasitic elements of semiconductor switches, common mode parasitic elements of power transmission lines and their interactions in a high integrated buck converter with one switching cell. In particular, the methodology helps the modeler to chose between several types of models for a given element, i.e. T −model or Π −model of the power transmission lines. The proposed methodology finally allows to obtain a representation well-adapted to the simulation of the behavior of the power converter including parasitic oscillations along time.

Les convertisseurs statiques permettent la maîtrise des flux d’énergie électrique échangés entre un générateur et un récepteur. Connaissez-vous le principe de modulation de largeur d’impulsions et son application dans la commande de ces dispositifs de l’électronique de puissance ?