With the introduction of Augmented Reality, Virtual Reality, and Mixed Reality (AR/VR/MR) applications, the fabrication of photonics devices is approaching a high volume manufacturing level. To scale these products to consumer friendly dimensions, there is still significant shrink needed for many not yet available components such as ultrasmall cameras, metalenses, microdisplays, and combiner optics. AR/VR/MR optical components include metalenses patterned over large areas, and the fidelity of these patterns may have a significant impact on performance. In this study, we apply OPC to the design intent and examine the implication of various lithographic and correction techniques on metalens performance through simulation. In addition, we investigate the root causes of the manufacturing process variability and its impact on metalens functionality. These devices are analyzed by comparing light propagation through the simulated manufactured system using rigorous lithographic models to the optimal system based on the design intent. The study finds that the size and shape of meta-atoms have a different impact on optical performance, depending on the type of the metalens.

Photonics represents a growing opportunity to design and manufacture devices and integrated circuits for applications in high-speed data communications, advanced sensing, and imaging. Photonic technologies provide orders-of-magnitude speed improvements with reduced power consumption for data transmission and ultra-sensitive sensing capabilities in multiple application domains. Curvilinear patterns are required to maintain the physical properties of light propagation. We investigate the readiness of state-of-the-art mask synthesis tools to meet the challenges for photonics devices in terms of mask data preparation and verification. We apply OPC and ILT to photonic integrated circuit designs containing components sensitive to fabrication variation, to generate Manhattan and curvilinear mask data. Results are validated using a lithography verification tool considering smoothness of the printed curved structures, a key factor to maintain the correct functionality of the photonic devices. Rather than using ideal targets, we take simulation contours from corrected layouts for initial assessment of light propagation through wave guides. The impact of lithographic patterning related perturbations such as resist line edge roughness on optical performance is investigated based on results from a rigorous lithography process simulation model. Experimental data from fabricated devices underline the usefulness of lithography simulation to predict unwanted impact on device performance and the need of correction tools to counteract these effects.

In this work, the simplified modeling of silicon phase modulators is presented along with a comparison among different options of modulators. The proposed simplified model enables a substantial reduction in computational effort while maintaining a good accuracy. The presented model is validated against complete 3D-simulations by means of the design of four different modulators. Furthermore, with the help of the model a deep insight on the performances tradeoffs in the choose and design of silicon modulators is provided.

In this paper, a simplified model of silicon phase modulators is presented that enables favorable accuracy together with a substantial reduction in computational effort and without the requirement of semiconductor TCAD device simulation software. This permits fast optimization of the different parameters of a modulator. The model was successfully implemented in Phoenix Optodesigner optical software allowing the optimization of silicon phase shifters for different applications. Moreover, this model presents a great potential for the simulation of modulators based on PN interdigitated junctions, which normally require complex and time consuming 3D simulations. Simulation time was reduced by a factor of 6 for the lateral PN junction based modulator, and two orders of magnitude reduction was obtained for interdigitated PN junctions based modulators.

Silicon photonics is nothing new. It has been around for decades, but in recent years, it has gained traction as electronic design challenges increase drastically with their atomic-level limitations. Silicon photonics has made significant advancements during this period, but there are many obstacles without an acceptable level of comfort as seen by the lack of semiconductor community involvement. Apart from a series of technological barriers, such as extreme fabrication sensitivity, inefficient light generation on-chip, etc., there are also certain design challenges. In this chapter, we will discuss the challenges and the opportunities in photonic integrated circuit design software tools, examine existing design flows for photonics design and how these fit different design styles, and review the activities in collaboration and standardization efforts to improve design flows.

This review discusses photonic IC design software tools, examines existing design flows for photonics design and how these fit different design styles and describes the activities in collaboration and standardization within the silicon photonics group from Si2 and by members of the PDAFlow Foundation to improve design flows. Moreover, it will address the lowering of access barriers to the technology by providing qualified process design kits (PDKs) and improved integration of photonic integrated circuit simulations, physical simulations, mask layout, and verification.

Protein detection and characterization based on Broad-band Mach-Zehnder Interferometry is analytically outlined and demonstrated through a monolithic silicon microphotonic transducer. Arrays of silicon light emitting diodes and monomodal silicon nitride waveguides forming Mach-Zehnder interferometers were integrated on a silicon chip. Broad-band light enters the interferometers and exits sinusoidally modulated with two distinct spectral frequencies characteristic of the two polarizations. Deconvolution in the Fourier transform domain makes possible the separation of the two polarizations and the simultaneous monitoring of the TE and the TM signals. The dual polarization analysis over a broad spectral band makes possible the refractive index calculation of the binding adlayers as well as the distinction of effective medium changes into cover medium or adlayer ones. At the same time, multi-analyte detection at concentrations in the pM range is demonstrated.

Broad-band Mach-Zehnder interferometry is analytically described and experimentally demonstrated as an analytical tool capable of high accuracy refractive index measurements over a wide spectral range. Suitable photonic engineering of the interferometer sensing and reference waveguides result in sinusoidal TE and TM spectra with substantially different eigen-frequencies. This allows for the instantaneous deconvolution of multiplexed polarizations and enables large spectral shifts and noise reduction through filtering in the Fourier Transform domain. Due to enhanced sensitivity, optical systems can be designed that employ portable spectrum analyzers with nm range resolution without compromising the sensor analytical capability. Practical detection limits in the 10(-6)-10(-7) RIU range are achievable, including temperature effects. Finally, a proof of concept device is realized on a silicon microphotonic chip that monolithically integrates broad-band light sources and single mode silicon nitride waveguides. Refractive index detection limits rivaling that of ring resonators with externally coupled laser sources are demonstrated. Sensitivities of 20 μm/RIU and spectral shifts in the tens of a pm are obtained.

To improve the design flow for silicon and other photonics technologies, companies from the photonics [1, 2] and electronics design automation [3] domain collaborate, to improve the integration of simulations, layout, verification and design rule checking.

A novel type of integrated optical sensor has been evaluated theoretically. The sensing is based on the large effect of the refractive index of the measurand (generally a liquid) to the mode profile of a guided mode close to the cut-off. A special type turns over into a leaky mode-based sensor. The sensor has small size and is simple to fabricate. For the SiON technology-based structures used as a vehicle for the evaluation, a resolution of the refractive index in the range of 10−6 RIU has been achieved; however, with an operation range around a certain working index of ≈2×10−4 RIU only. This working index can be shifted to any desired value, within a certain range, by appropriately choosing the geometrical and material parameters. Because of technological tolerances, for practical operation, read-out based on wavelength scanning is required. The sensor can be used especially as an alarming sensor.

A flexible and efficient method for fully vectorial modal analysis of 3D dielectric optical waveguides with arbitrary 2D cross-sections is proposed. The technique is based on expansion of each modal component in some a priori defined functions defined on one coordinate axis times some unknown coefficient-functions, defined on the other axis. By applying a variational restriction procedure the unknown coefficient-functions are determined, resulting in an optimum approximation of the true vectorial mode profile. This technique can be related to both Effective Index and Mode Matching methods. A couple of examples illustrate the performance of the method.

Whispering gallery modes supported by open circular dielectric cavities are embedded into a nonparametric two-dimensional frequency domain hybrid coupled mode theory framework. Regular aggregates of these cavities, including straight access channels, are investigated. The model enables convenient studies of the guided wave scattering process, the response of the circuit to guided wave excitation. Transmission resonances can be characterized directly in terms of resonance frequency and linewidth by computing supermodes of the entire composite circuits, comprising both cavities and bus waveguides. Examples of single ring and disk filters, a coupled-resonator optical waveguide, and a three-cavity photonic molecule in a reflector configuration allow the approach to be assessed.

Miniaturized bioanalytical devices find wide applications ranging from blood tests to environmental monitoring. Such devices in the form of hand held personal laboratories can transform point-of-care monitoring provided miniaturization, multianalyte detection and sensitivity issues are successfully resolved. Optical detection in biosensors is superior in many respects to other types of sensing based on alternative signal transduction techniques, especially when both sensitivity and label free detection is sought. The main drawback of optical biosensing transducers relates to the unresolved manufacturability issues encountered when attempting monolithic integration of the light source. If the mature silicon processing technology could be used to monolithically integrate optical components, including light emitting devices, into complete photonic sensors, then the lab on a chip concept would materialize into a robust and affordable way. Here, we describe and demonstrate a bioanalytical device consisting of a monolithic silicon optocoupler properly engineered as a planar interferometric microchip. The optical microchip monolithically integrates silicon light emitting diodes and detectors optically coupled through silicon nitride waveguides designed to form Mach-Zehnder interferometers. Label free detection of proteins is demonstrated down to pM sensitivities.

Despite the advances in optical biosensors, the existing technological approaches still face two major challenges: the inherent inability of most sensors to integrate the optical source in the transducer chip, and the need to specifically design the optical transducer per application. In this work, the development of a radical optoelectronic platform is demonstrated based on a monolithic optocoupler array fabricated by standard Si-technology and suitable for multi-analyte detection. The platform has been specifically designed biochemical sensing. In the all-silicon array of transducers, each optocoupler has its own excitation source, while the entire array share a common detector. The light emitting devices (LEDs) are silicon avalanche diodes biased beyond their breakdown voltage and emit in the VIS-NIR part of the spectrum. The LEDs are coupled to individually functionalized optical transducers that converge to a single detector for multiplexed operation. The integrated nature of the basic biosensor scheme and the ability to functionalize each transducer independently allows for the development of miniaturized optical transducers tailored towards multi-analyte tests. The monolithic arrays can be used for a plethora of bio/chemical interactions becoming thus a versatile analytical tool. The platform has been successfully applied in bioassays and binding in a real-time and label-free format and is currently being applied to ultra-sensitive food safety applications.