The SATAS (Semiconductor Assembly Test Automation and Standardization) Research Association was kicked off in April 2024. [1] SATAS is supported by the Japan Ministry of Economy, Trade and Industry (METI) and includes 23 member companies, all with the joint goal of transforming conventional assembly test manufacturing by developing strategies to automate the manufacturing process. The consortia will initially develop standards to support the equipment, systems and interfaces necessary for automation. The new concepts will then be implemented in a pilot line to evaluate and demonstrate the standards and automation systems, as well as measure the labor savings and manufacturing efficiencies that automation enables. This paper describes the overall SATAS concepts, plans and goals, initial simulation results of the new automation concepts, as well as the goals and progress to date developing industry standards that will support the overall SATAS goals.
Someday soon a perfectly ripe tomato growing on a vine is going to signal its condition via the 5G network to an AI who knows about heirloom tomatoes at their peak; this AI will place an order for its customers based on standing instructions, after first confirming said customers are indeed expected home that evening. An autonomous vehicle, perhaps a drone, will then be dispatched to rendezvous with a fieldworker who will hand over the ripe treasure while a blockchain payment transaction runs in the background. The Level 5 AV will then whisk what is now a sold and on-its-way tomato back home, making it available for the evening meal.
Like the 300mm standards, the 450mm physical interface standards define the multitude of parameters that are essential to factory automation and interoperability. In addition, 450mm standards drive factory efficiency much farther than the 300mm standards did. This paper will review the standards architecture and critical parameters defined by the standards with a focus on the efficiency improvements that were incorporated into the 450mm standards using the learning that the industry has acquired over the last 15 years.
Like the 300mm standards, the 450mm physical interface standards define the multitude of parameters that are essential to factory automation and interoperability. In addition, 450mm standards drive factory efficiency much farther than the 300mm standards did. This paper will review the standards architecture and critical parameters defined by the standards with a focus on the efficiency improvements that were incorporated into the 450mm standards using the learning that the industry has acquired over the last 15 years.
The big picture for the semiconductor industry shows slowing but still positive sales growth, a push back of the transition to 450 mm wafers to perhaps the next decade, and potential commercial implementation of EUV for some layers of some sub-10 nm nodes by 2019–2020.1–3 Per Gartner, current revenue growth is driven by smartphones, solid-state drives, and DRAM.1 A new semiconductor sector, wearab...
The papers in this special section were presented at the 2013 Advanced Semiconductor Conference (ASMC).
First Wafer Delay (FWD) has been identified as a barrier to reduced fab cycle time and increased equipment productivity. As such, initiatives to reduce first wafer delay have been proposed as a focal point for next generation semiconductor fabs, including both 450mm fabs as well as "300mm Prime" factories. FWD and Setup Time are major detractors for cycle time reduction, in particular for small lot manufacturing. The definition of FWD, causes, as well as methods for improving FWD are discussed, in addition to recommendations for future equipment and factory design.
