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个人简介
Hui Pan (M’00–SM’13) received the B.E. degree in optoelectronics and the M.S. degree in applied physics from Tsinghua University, Beijing, China, in 1983 and 1986, respectively, and the Ph.D. degree in electrical engineering from the University of California, Los Angeles (UCLA), in 1999. From 1986 to 1991, he was an Assistant Professor with the Applied Physics Department, Tsinghua University. In 1992, he joined the Photonics Research Lab, State University of New York at Buffalo, where he studied organic compounds and polymers for nonlinear optics. During his employment with Broadcom Corporation starting end of 1999 through 2015, he led development of four generations of multi-gigabit physical layer (PHY) products for enterprise, consumer, and automotive applications. From 2016 to 2020, he was a Technical Director and Distinguished Engineer with the Mixed Signal ASIC Products Division of Broadcom Limited developing large-volume ASIC products for flagship mobile applications such as 5G base station and satellite internet.
Dr. Pan was the recipient of the 1998 Analog Devices Outstanding Student Designer Award and the Honorable Mention of 2000 Design Automation Conference Student Design Contest. He served on the ISSCC Technical Program Committee (TPC) from 2006 to 2010 and on the Compound Semiconductor Integrated Circuit Symposium TPC from 2014 to 2017. He has been an Associate Editor for IEEE Journal of Solid-State Circuits since 2018.
研究兴趣
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international solid-state circuits conference (2016): 186-187
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mag(2014)
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2014 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC) (2014): 148-+
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Hui Pan,Magesh Valliappan, Wei Zhang,Kambiz Vakilian,Seong-Ho Lee,Hamid Hatamkhani,Mario Caresosa, Karo Khanoyan,Haitao Tong, Duke Tran,Anthony Brewster,Ichiro Fujimori
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