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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 28 篇作者统计合作学者相似作者

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Tunable Etch Profile for Scandium Doped Aluminum Nitride Piezoelectric Film
Quek Zhan Jiang,Lin Huamao, Tsang Yat Fung,B.S.S. Chandra Rao
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.594-597, (2022)
引用0浏览0EIWOS引用
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Wafer Stacked Wide I/O DRAM with One-step TSV Technology
Masaya Kawano,Xiang-Yu Wang,Qin Ren,Woon-Leng Loh,B. S. S. Chandra Rao,King-Jien Chui,Tsuyoshi Kawagoe, Ichiro Homma
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.143-148, (2022)
引用2浏览0EIWOS引用
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Wafer Stacked Wide I/O DRAM with One-step TSV Technology
Motoharu Kawano,Xiangyu Wang, Qiushi Ren, Wann Jia Loh,B.S.S. Chandra Rao,King-Jien Chui, Takeshi Kawagoe, Ichiro Homma
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
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Line Edge Roughness Optimization of Photonics Components in Electronics Photonics Heterogeneous Integration
Arvind Sundaram, Tew Ching Khang, Tan Guo Wei, HaiTao Yu,B.S.S. Chandra Rao, Navab Singh
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.142-145, (2022)
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Reduction of Aluminum Fluoride Formation during Fluorinated Plasma Etching of Dielectric Passivation Layer over Aluminum Pad
Darshini Senthilkumar, Kalyn Lim Tien Shee,B.S.S. Chandra Rao
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.175-178, (2022)
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Through Silicon Via Oxide Etch Back for Via-last Integration Scheme
Hemanth Kumar Cheemalamarri, Darshini Senthilkumar,B.S.S. Chandra Rao
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.973-976, (2022)
引用0浏览0EIWOS引用
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One-step TSV process development for 4-layer wafer stacked DRAM
Masaya Kawano,Xiang-Yu Wang,Qin Ren,Woon-Leng Loh,B. S. S. Chandra Rao,King-Jien Chui
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.673-679, (2021)
引用2浏览0EIWOS引用
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Development of Metallization Process for Fine Pitch TSV
Gilho Hwang, Ji Hong Miao,B.S.S Chandra Rao
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)pp.633-636, (2021)
引用2浏览0EIWOS引用
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Silicon Isolation Trench Integration for the 4-stack Memory Wafer
Xiangyu Wang,Masaya Kawano,B.S.S. Chandra Rao
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)pp.664-667, (2021)
引用1浏览0EIWOS引用
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