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Chia-Hsin Lee received the B.S. degree in chemistry from Taughai University, Taichung City, Taiwan, in 1999, the M.S. degree in atomic science from National Tsing Hua University, Hsinchu, Taiwan, in 2001, and the Executive M.B.A. degree from The University of Texas at Arlington, Arlington, TX, USA, in 2014. He is currently pursuing the Ph.D. degree with the International College of Semiconductor Technology, National Yang Ming Chiao Tung University, Hsinchu.
He has been with Brewer Science, Inc., Rolla, MO, USA, since 2007, and is currently the regional director in Asia. He has authored or coauthored more than 20 technical articles related to advanced packaging, including an award-winning paper (best of track and best of session) in I.
Mr. Lee has been an active member of IEEE since 2010 and a Committee Member of IEEE EPTC and ECTC since 2011 and 2016, respectively.
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论文共 11 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 8 (2023): 1316-1323
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IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.2128-2134, (2022)
Ching Kuan Lee, Wen-Hung Liu, Shu-Yi Chang,Ren-Shin Cheng,Yu-Min Lin,Hsiang-En Ding,Wei-Lan Chiu,Tao-Chih Chang,Chia-Hsin Lee,Chang-Chun Lee
2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)pp.55-56, (2022)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1076-1081, (2021)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.736-741, (2021)
Electronic Components and Technology Conferencepp.1463-1469, (2019)
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