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职业迁徙
个人简介
Justin See Toh received the Graduate degree from the School of Materials Science and Engineering, Nanyang Technological University, Singapore, in 2009.
He joined the Agency for Science, Technology and Research Institute of Microelectronics, Singapore, as a Research Engineer. He is currently the Module Engineer for Cu/Sn electroplating for redistributing line, under bump metallurgy, seal rings and bumps, and involved in the development of temporary bonding adhesives for thin wafer handling.
Mr. Toh participated in backend wafer level processed development and integration for Electronic Packaging Research Consortium (EPRC) 10, EPRC 11, Micro-Electro-Mechanical Systems Consortium, and Gale Force-Sand 9.
研究兴趣
论文共 3 篇作者统计合作学者相似作者
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期刊级别
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合作机构
Components, Packaging and Manufacturing Technology, IEEE Transactionsno. 12 (2011): 1988-1995
作者统计
#Papers: 3
#Citation: 27
H-Index: 3
G-Index: 3
Sociability: 2
Diversity: 1
Activity: 0
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