The sulfur bioconversion-associated processes (SBAP) for sewage treatment have been extensively reported so far. In this study, biological thiosulfate reduction (BTR)-driven biotechnology for high rate sulfidogenesis and organic removal was explored to further close the gap of our knowledge on the sulfur cycle-based sewage treatment bioprocess. With thiosulfate as the electron acceptor, the sulfidogenic rate in the UASB rector is 105.6 mg S/L/h with the sludge yield of only 0.044 g MLVSS/g CODsubstrate. Thus providing sufficient electron donors or chemical sources (i.e. HS-) for the downstream autotrophic denitrification or for the cost-effective heavy metal precipitation. Thiosulfate disproportionation was not observed in BTR reactor. High-throughput pyrosequencing analysis reveals that Desulfobulbus and Desulfomicrobium are the predominant thiosulfate-reducing genera and the thiosulfate disproportionation-bacteria were at much lower genus level. The specific thiosulfate-reducer i.e. Dethiosulfatibacter which could utilize thiosulfate but not sulfate as the electron acceptor was also identified. Batch testing results indicate that the sulfidogenic activity on thiosulfate was 1.5 times that on sulfate. The optimal pH for BTR activity was between 7.0 and 8.0, a typical pH range of the municipal sewage. Thiosulfate can be efficiently recovered in the sulfide-driven denitritation reactor enriched with abundant sulfide-oxidizing genera (mainly including Thiobacillus and Sulfurimonas). Finally, a conceptual model of the sulfur cycle based on the biotransformation between thiosulfate and sulfide was established, offering new insights into the sustainable SBAP with sludge minimization. (C) 2019 Published by Elsevier Ltd.

Objective:To perfrome a Meta analysis on the relation of p53,FHIT,K-RAS gene mutations and abnormal expression in non-small cell lung cancer patients with smoking.Methods: Chinese Academic Journals Online(CNKI),China Science and Technology Periodical Database(VIP Information Network),the U.S.National Library of PubMed database and the U.S.Society of Clinical Oncology(ASCO) proceedings were searched from 1990 to 2010.A systematic review identified 197 prospective studies concerning p53,FHIT,K-RAS genes and smoking,from which 26 literatures were selected.The 26 included studies were methodologically assessed and analyzed by Review Manager 5.0.Fixed-effects Meta-analyses were conducted for each factor to combine odds ratio(OR)and/or relative risk(RR)outcomes across studies by study design.Overall raw point estimates of each risk factor and associated 95% confidence intervals(CI)were calculated.Results: A total of 26 studies were selected,the statistical content of the same statistics were pooled combined OR values and 95%CI of p53,FHIT,K-RAS gene mutation and smoking were caloulated p53 gene mutation in smokers was higher,showed low expression2.45-5.00),Z=6.88,P0.0001];K-RAS gene mutation in smokers was significantly higher,Showed high expression;FHIT gene mutation in smokers was higher,showed lowexpression[OR=2.99,95%CI(1.01-8.88),Z=1.98,P=0.005].Conclusion:The relationship between smoking and p53,FHIT,K-RAS gene mutation rate was positively correlated,in which p53,FHIT gene high expression isa protective factor,and K-RAS gene expression is a risk factor.

The industrial enterprise ingredients are the most important in the production process of procedure, ingredients and decided the accuracy directly affect the quality of the final product, this paper designed a set of automatic computer batching system in industrial production, and get a good application.

Embedded chip technology can enhance the density of electronic assembly as well as the reliability of electronic products,and it becomes the development trend of microelectronic packaging.The finite element model of embedded chip in polymer(CiP) was built and the maximum equivalent stress,peel stress and equivalent plastic strain were analyzed.The key position of structure failure was obtained.The modified Coffin-Manson formula was employed to predict the fatigue life and the impact of copper line thickness on the fatigue life was surveyed.The results show that the maximum equivalent stress,peel stress and equivalent plastic strain easily lead to crack or delamination,which always appear at the interface of copper vias and pads.The thickness of copper line plays an important role in fatigue failure and increasing the thickness of the copper line will enhance the fatigue life significantly.

The global model of flip chip device and the local model of Cu/low-k structures were established by FEM. The thermo-mechanical reliability of Cu/low-k structures was analyzed during the curing process and thermal cycling conditions. The results shows that reliability problem is prone to occurred at the interface of metal interconnect and low-k material. The maximum equivalent stress will increase using low-k material and cu interconnect, in addition, the impact of the through-hole width on thermal stress of low-k material and cu interconnect that is not obvious.

The strength for a set of dies (the number of dies is 30) was tested by the four-point bending test. Weibull statistical model was used to describe the distribution of the die failure probability, and the die failure probability during subsequent thermal cycling was predicted. The effects of the curing process of the underfill on the vertical crack stress on top of the die, maximum equivalent stress of the low-k layer and equivalent plastic stain of the solder joint were investigated by finite element software. The results show that the die failure probability is increased from 0.08% to 0.37%, the equivalent plastic stain of the solder joint is increased by about 7 times than that without considering curing process, and the maximum equivalent stress of the low-k layer is increased by about 18% due to the curing process of the underfill.

A gate trigger unit (GTU) design is proposed based on cascaded H-bridge voltage reinjection multilevel voltage source configuration (MLVR-HB-VSC) for use in large power and voltage ratings. Specific Implementation of gate-level trigger was analysis to guarantee dynamic voltage balance of compactors in the circuit. Grid synchronization, judgment of edge state changes, capacitor voltage balance and some crucial technical issues what should be pay attention to are analyzed in detail. To verify the steady state and dynamic behavior of gate-level trigger unit, extensive simulation is carried out with reference to the STATCOM application.

The finite element software MSC.Marc was employed to investigate the influence of the adhesive fillet shapes and dimension parameters on the thermal stress of microelectronics packaging QFN device.The results show that in the case of same finite element mesh density,the adhesive fillet shape has significant influence on the thermal stress of QFN devices.The maximum thermal stress of QFN device is 85.87 MPa without adhesive overflow fillet,while the thermal stress decreases to 77.84 MPa with adhesive overflow fillet.And the location of maximum thermal stress is different with different adhesive fillet shape.The thickness and width of the adhesive have little effect on the thermal stress.The distribution of interfacial thermal stress has a great difference with different adhesive fillet shapes.

At present, it has become a trend that low-k dielectric and copper interconnect integration process is introduced in IC manufacturing, so the reliability analysis of the low-k structures in package device is necessary.In this paper, the effects of the size parameters of the flip-chip device on low-k layer and solder joints reliability were investigated by finite element software.The results showed that:thinner die, thinner the PI layer, taller solder joint height, taller Cu pad height, thinner substrate can alleviate the maximum equivalent stress of the low-k layer;while thinner die, thicker PI layer, taller solder joint height, lower Cu pad height, thinner substrate can reduce the equivalent plastic strain of solder joints.

This study presents an optimal method to select the material and dimension parameters for designing microelectronics packaging devices loading hygro-thermal and vapor pressure. The failure mechanism for delamination of actual packaging devices is often a complex nonlinear function, which is a shortcoming of traditional methods. The proposed approach is a combination of Error back-propagation neural network (BPNN), principal component analysis (PCA) and genetic algorithms (GAs). First of all, PCA is employed to reduce the dimension and de-noise for the learning matrix of BPNN model. And then GAs is combined with the BPNN model to find the most appropriate linking weight with its global search feature. Secondly, the well-trained network model, which included a nonlinear function between the input parameters and corresponding outputs, is seen as a prediction tool to select optimal parameter size in order to reduce the J-integral value of interface cracking in the packaging device. Finally, optimal parameter groups can be achieved for the device after verification. The optimization results show the well-trained PCA-GA-BPNN model used the proposed approach, can be used well in the optimizing design of the microelectronics packaging device loading hygro-thermal and vapor pressure. Meanwhile, the model is available to reduce the fracture reliability problems, and is of much practical value.

In Flip Chip package, the curing process of the underfill polymer will induce extra residual stress and strain fields. For simplicity reasons, in thermo-mechanical analyses, the curing induced stress state was usually neglected by assuming a so-called "stress-free" temperature. However, such simplification is not verified, in particular for advanced IC chips such as copper-low-k interconnects, which is very sensitive to the stress level it undergoes.An investigation on the die failure issues in copper-low-k Flip Chip Package with consideration of packaging process-induced stresses was presented in this paper. Firstly, a cure-dependent viscoelastic model was applied to describe the properties of the underfill resin during the curing process and subsequent thermal cycling. Secondly, prediction of die fracture failure probability was conducted. Weibull statistics model was used to describe the probability distribution for the die strength test. Model parameters were obtained by fitting to the test results. Fracture failure probability of the die backside was calculated based on the Weibull statistics model and the stress states induced in the curing processes and test condition. Thirdly, the stress state on the copper-low-k layer was investigated. The results show that maximum stress occurs at top interface of the low-k layer structure. The cure-induced stresses play a significant role on the total stress level. The effect of the packaging process-induced stress cannot be simply neglected.

With the development trend of microelectronic system with small size, high speed, high frequency and high density, passive and active components are directly embedded into a core or high-density-interconnect layers. This System-in-Package (SiP) technology could shorten interconnection between the die and substrate and reduce the inductance and noise interference. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structure. An embedded structure was chosen in this study. The embedded chip was surrounded by epoxy. An epoxy was selected as the adhesive to embed the chip. The active surface of the chip was face up, to form a planar surface with the substrate. Benzocylobutene (BCB) was chosen as the dielectric polymer for embedding technology because of its low curing temperature. One quarter 3D model of embedded structure was loaded on six thermal cycles according to the temperature cycling standards JESD22-A104C. The thermo-mechanical reliability was investigated and the modified Coffin-Manson equation was employed to predict the fatigue life of copper films. FEA simulation results revealed that the fatigue life of copper film is 35.7 cycles. Stresses in the die always lead to various failures in manufacturing and using process, so equivalent von Mises stress and peel stress were also analyzed in this study.

This paper provides a useful method to solve optimal simple rules under risk sensitive preference in macromodels with forward looking behavior. An application to a new Keynesian model with lagged dynamics is offered and risk sensitive preference is found to amplify the policy responses.

This paper examines policy rule choices for a central bank that faces uncertainty about the process of expectation formations by economic agents. The economy contains both ‘rule-of-thumb’ agents who base their expectations on recent observations and agents who have rational expectations. The central bank is uncertain about the fraction of the rule-of-thumb agents. I find that when the economy is more forward-looking, the central bank responds more aggressively to inflation and output. But the uncertainty-averse central bank evaluates policies by the performance in the worst case. In my economy the worst case is when a large fraction of agents are backward-looking. Therefore the best policy for the uncertainty-averse central bank involves moderate responses. This minimax rule agrees more closely with empirically estimated less responsive Taylor rules. The paper also uncovers the importance of expectation formations on optimal policy choices.

Volumetric 3-D displays proposed and demonstrated in the past have been low in resolution and refresh rate, but not in cost. This paper describes the development of an electro-optic multiplanar volumetric 3-D display (without moving parts) based on unique liquid crystal (LC) switchable light diffusion panels. These LC switchable diffuser panels are produced by our proprietary holographic Light Shaping Diffuser fabrication process. Using a stack of closely spaced LC switchable diffusers, which have shown excellent switching speed, diffusion efficiency, and clarity, a multiplanar volumetric 3-D display was demonstrated, projecting full-color 2-D images from a high speed spatial light modulator.

This paper describes the development of a non-contact diagnosis system for analyzing the plasma density profile, temperature profile, and ionic species of a high energy laser-generated plasma. The system was developed by Physical Optics Corporation in cooperation with the U.S. Army Space and Missile Defense Command, High Energy Laser Systems Test Facility at White Sands Missile Range, New Mexico. The non- contact diagnostic system consists of three subsystems: an optical fiber-based interferometer, a plasma spectrometer, and a genetic algorithm-based fringe-image processor. In the interferometer subsystem, the transmitter and the receiver are each packaged as a compact module. A narrow notch filter rejects strong plasma light, passing only the laser probing beam, which carries the plasma density information. The plasma spectrum signal is collected by an optical fiber head, which is connected to a compact spectrometer. Real- time genetic algorithm-based data processing/display permits instantaneous analysis of the plasma characteristics. The research effort included design and fabrication of a vacuum chamber, and high-energy laser plasma generation. Compactness, real-time operation, and ease of use make the laser plasma diagnosis system well suited for dual use applications such as diagnosis of electric arc and other industrial plasmas.

The nonmetal possibility of rotating disk type SOG has been studied experimentally. The results indicated that it is possible to use the fiberglass as rotating disk to substitute metal disk, such as Ni disk and stainless steel.