The IBM POWER9 processor is the latest Reduced Instruction Set Computer microprocessor from IBM. POWER9 employs a new modular core microarchitecture to counter the technology trend of decreasing frequency and increasing power density from generation to generation. The new POWER9 design enables a family of processors optimized for a broad range of server applications. The new microarchitecture is closely coupled with a rich set of new instructions geared toward data-centric applications. In this paper, we describe the POWER9 core microarchitecture innovations, its new instructions and features, and the exploitation of this new design for computing in the cognitive era.

The POWER8™ processor is the latest RISC (Reduced Instruction Set Computer) microprocessor from IBM. It is fabricated using the company's 22-nm Silicon on Insulator (SOI) technology with 15 layers of metal, and it has been designed to significantly improve both single-thread performance and single-core throughput over its predecessor, the POWER7® processor. The rate of increase in processor frequency enabled by new silicon technology advancements has decreased dramatically in recent generations, as compared to the historic trend. This has caused many processor designs in the industry to show very little improvement in either single-thread or single-core performance, and, instead, larger numbers of cores are primarily pursued in each generation. Going against this industry trend, the POWER8 processor relies on a much improved core and nest microarchitecture to achieve approximately one-and-a-half times the single-thread performance and twice the single-core throughput of the POWER7 processor in several commercial applications. Combined with a 50% increase in the number of cores (from 8 in the POWER7 processor to 12 in the POWER8 processor), the result is a processor that leads the industry in performance for enterprise workloads. This paper describes the core microarchitecture innovations made in the POWER8 processor that resulted in these significant performance benefits.

This paper gives an overview of the latest member of the POWER™ processor family, POWER7™. Eight quad-threaded cores, operating at frequencies up to 4.14 GHz, are integrated together with two memory controllers and high speed system links on a 567 mm die, employing 1.2B transistors in a 45 nm CMOS SOI technology with 11 layers of low-k copper wiring. The technology features deep trench capacitors which are used to build a 32 MB embedded DRAM L3 based on a 0.067 m DRAM cell. The functionally equivalent chip transistor count would have been over 2.7B if the L3 had been implemented with a conventional 6 transistor SRAM cell. (A detailed paper about the eDRAM implementation will be given in a separate paper of this Journal). Deep trench capacitors are also used to reduce on-chip voltage island supply noise. This paper describes the organization of the design and the features of the processor core, before moving on to discuss the circuits used for analog elements, clock generation and distribution, and I/O designs. The final section describes the details of the clocked storage elements, including special features for test, debug, and chip frequency tuning.