Reliability data are shown for InP photonic integrated circuits (PICs) comprising 10 channels at 10 Gb/s. Over 1.3 billion hours of field operation has been reached for PIC pairs without any field failures, corresponding to <;0.8 FIT.

We report on the development of monolithically integrated multi-wavelength coherent transmitter and receiver PICs employing polarization multiplexing and advanced phase-shift keying modulation to provide an aggregate bandwidth greater than 1Tbps on a single chip.

The status and progress of InP photonic integration is reviewed. Infinera has previously reported on the manufacturing of 100 Gb/s InP-based large-scale photonic integrated circuits. These PICs, based on amplitude modulation and with more than 50 discrete functions per chip, have now reached a high level of manufacturing maturity, and have furthermore redefined reliability standards for InP components, having achieved more than 900 million field hours without a single failure as of this writing. In this paper, we will describe manufacturing status for the 3rd generation of Infinera’s LS-PICs, which feature 500 Gb/s capacity using phase modulation on the transmitter chip, and coherent detection on the receiver chip, and which now form the heart of Infinera’s 500G DTN-X transport system, released in mid-2012. These new PICs have an order-of-magnitude increase in chip complexity, and a commensurate increase in fabrication complexity from III-V epitaxy through wafer fab, die fab, and test. The architecture and performance of Infinera’s PICs will be described, along with relevant yield and production metrics that demonstrate this platform is at once manufacturable and scalable.

We will present state of the art performance of monolithically integrated 500 Gb/sec and 1 Tb/s coherent transmitter and receiver PICs with integrated multi-channel tunable laser arrays optimized for coherent transmission.

In this talk, we describe the monolithic integration of 10 InP-based phase-modulated transmitter channels employing polarization multiplexing and quadrature phase-shift keying coherent modulation format to provide an aggregate 500Gb/s bandwidth on a single chip.

In this work, a 10-wavelength, polarization-multiplexed, monolithically integrated InP coherent QPSK transmitter PIC is demonstrated to operate at 112 Gb/sec per wavelength and total chip superchannel bandwidth of 1.12 Tb/s. This demonstration suggests that increasing data capacity to multi-Tb/s per chip is possible and likely in the future.

A 10-wavelength, polarization-multiplexed, monolithically integrated InP transmitter PIC is demonstrated for the first time to operate at 112 Gb/s per wavelength with a coherent receiver PIC.

We report on the current state of large-scale and high functionality photonic integrated circuits on the InP platform for transmitters, receivers, and other device applications.