We demonstrate a single-chip, monolithically integrated, dual-polarization QPSK transmitter which combines over 1700 functions and is capable of delivering 2.25 Tb/s of bandwidth.
A dual-polarization QPSK transmitter is demonstrated with a record 40 tunable distributed feedback lasers, 80 nested Mach-Zehnder-modulators, and other elements totaling over 1700 functions monolithically integrated on a single InP-based chip that is capable of delivering 2.25 Tb/s.
The status and progress of InP photonic integration is reviewed. Infinera has previously reported on the manufacturing of 100 Gb/s InP-based large-scale photonic integrated circuits. These PICs, based on amplitude modulation and with more than 50 discrete functions per chip, have now reached a high level of manufacturing maturity, and have furthermore redefined reliability standards for InP components, having achieved more than 900 million field hours without a single failure as of this writing. In this paper, we will describe manufacturing status for the 3rd generation of Infinera’s LS-PICs, which feature 500 Gb/s capacity using phase modulation on the transmitter chip, and coherent detection on the receiver chip, and which now form the heart of Infinera’s 500G DTN-X transport system, released in mid-2012. These new PICs have an order-of-magnitude increase in chip complexity, and a commensurate increase in fabrication complexity from III-V epitaxy through wafer fab, die fab, and test. The architecture and performance of Infinera’s PICs will be described, along with relevant yield and production metrics that demonstrate this platform is at once manufacturable and scalable.
We will present state of the art performance of monolithically integrated 500 Gb/sec and 1 Tb/s coherent transmitter and receiver PICs with integrated multi-channel tunable laser arrays optimized for coherent transmission.
The details of a monolithically integrated, five-channel, dual carrier/wavelength per channel, polarisation multiplexed, coherent QPSK receiver on InP operating at 114 Gbit/s per channel are discussed.
In this talk, we describe the monolithic integration of 10 InP-based phase-modulated transmitter channels employing polarization multiplexing and quadrature phase-shift keying coherent modulation format to provide an aggregate 500Gb/s bandwidth on a single chip.
In this work, a 10-wavelength, polarization-multiplexed, monolithically integrated InP coherent QPSK transmitter PIC is demonstrated to operate at 112 Gb/sec per wavelength and total chip superchannel bandwidth of 1.12 Tb/s. This demonstration suggests that increasing data capacity to multi-Tb/s per chip is possible and likely in the future.
In this talk, we report on a pair of monolithically integrated multi-wavelength transmitter and receiver PICs employing polarization multiplexing and quadrature phase-shift keying modulation to provide an aggregate bandwidth greater than 1Tbps on a single chip.
A 10-wavelength, polarization-multiplexed, monolithically integrated InP transmitter PIC is demonstrated for the first time to operate at 112 Gb/s per wavelength with a coherent receiver PIC.
InP photonic integrated circuits (PICs) for advanced modulation format transmission, which enable high spectral efficiency, reduced complexity, high reliability, and low power consumption, will be reviewed.
We report on development of large-scale and high functionality photonic integrated circuits on InP and Si platforms for transmitter, receiver, filtering and routing applications and discuss the merits of both platform.
We report the first demonstration of a large-scale InP-based transmitter photonic integrated circuit (PIC) capable of 10-channel x 40 Gb/s per wavelength polarization-multiplexed RZ-DQPSK modulation. (C) 2008 Optical Society of America
Demonstrated are 40-channel transmitter and receiver large-scale photonic integrated circuits operating as a pair at 12.5 Gbit/s.
A single-chip 40-channel dense wavelength division multiplexed, monolithic, InP transmitter photonic integrated circuit capable of operating at per channel data rate of 40 Gbit/s for a combined data rate of 1.6 Tbit/s is demonstrated.
100 Gb/s transmitters and receivers are realized through the monolithic integration of over 50 discrete functions onto a single InP chip. The modules are capable of simultaneously transmitting and receiving 10 DWDM wavelengths at >10 Gb/s.
100 Gb/s transmitters and receivers are realized through the monolithic integration of over 50 discrete functions onto a single InP chip. The modules are capable of simultaneously transmitting and receiving 10 DWDM wavelengths at >10 Gb/s.