1.6 Tb/s optical engine is enabled through vertical integration of a 2-channel monolithic InP PIC with SiGe electronics and a real-time DSP ASIC operating at 100 Gbaud for 800 Gb/s transmission.

First demonstration of a real-time 100.4 GBd PCS-64QAM 2 × 800G coherent MODEM. A record transmission distance of 1600 km is achieved for a dual-carrier 1.6 Tb/s channel over a fully loaded commercial line system, with an OSNR margin in excess of 2 dB to the FEC threshold.

We report on the development of a $2\times 800$ Gbps/wave coherent module based on a monolithic InP transceiver PIC and real-time 7nm DSP ASIC capable of 800Gbps data transmission over record 1000km SMF-28 link using a 96Gbaud, PCS-64QAM modulation format.

We present our recent progress in coherent transmitters (Tx) and receivers (Rx) based on Photonic Integrated Circuits (PIC) on the InP platform. We demonstrate signal generation and transmission at 800 Gbit/s per optical channel.

We present a 1.6Tbps coherent transceiver delivering 800Gbps/wave transmission using integrated Tx/Rx functions with 50GHz bandwidth and 50kHz linewidth tunable lasers on a single 2-channel InP PIC, paired with a SiGe Driver and TIA ASIC.

Application-specific integrated circuit (ASIC) is at the core of modern ultra-high-speed transponders employing advanced digital signal processing (DSP) algorithms. Jointly to advanced transmission techniques, such as probabilistic shaping and digital sub-carrier multiplexing, it enables high capacity coherent transmission. In this invited contribution, we present our recent data-rate × distance record with experimental transmission of all real-time 800G channel over 1000 km in full C-band.

We present multi-channel monolithically integrated InP based photonic integrated circuits emitting in both the C and L bands with 200 Gbps transmission per wavelength, enabling long haul links with up to 57.6 Tbps capacity.

We show 100 GBd 32QAM transmission enabled by hybrid integration of InP PICs featuring 40 kHz linewidth widely tunable lasers and SiGe electronics. A mean Q-factor of 6.2 dB after 500 km transmission is measured, demonstrating the feasibility of 800 Gbit/s waves for extended-reach applications.

We present the first fully monolithically integrated coherent receiver and transmitter PIGs in L-band with performance capability comparable to their C-band counterparts, and demonstrate a C+L link with superchannels under dual-polarization, 16-QAM modulation at 33 GBaud $(200\ Gbps/\lambda)$ .

State-of-the-art monolithically integrated, multi-channel InP-based system on chip (SOC) photonic ICs have been developed to implement Tb/s class coherent transmitters and receivers with extended C-band tunability. A 14-channel PIC architecture is demonstrated enabling 4.9 Tb/s total capacity using 44 Gbaud 16-QAM coherent modulation. Furthermore, multi-channel coherent transmitter PIC with hybrid integrated with SiGe drivers capable of operating up to 1.0 Tb/s per wave, utilizing 100 GBaud, 32QAM modulation are demonstrated. OCIS codes: (250.0250) Optoelectronics; (060.0060) Fiber optics and optical communications; (250.5300) Photonic integrated circuits; (060.1660) Coherent Communications

InP-based $4\times 600$ Gb/s capable coherent transmitter and receiver assemblies with hybrid integrated SiGe drivers operate at 66GBd, 64QAM over a 200km link. Additionally, a fully packaged pair of modules with real-time DSP ASIC operates error free at 600Gb/s with 69GBd, DP-64QAM.

We report InP-based coherent transmitter PICs with hybrid integrated SiGe drivers operating at 100GBd, 32QAM back-to-back (1 Tb/wave capable), and at 100GBd, 16QAM over 1400km. Coherent Tx (Rx) PICs with hybrid integrated drivers (amplifiers) operate at 66GBd, 64QAM over 200km.

Fully integrated monolithic, multi-channel InP-based coherent receiver PICs and transceiver modules with extended C-band tunability are described. These PICs operate at 33 and 44 Gbaud per channel under dual polarization (DP) 16-QAM modulation. Fourteen-channel monolithic InP receiver PICs show integration and data rate scaling capability to operate at 44 Gbaud under DP 16-QAM modulation for combined 4.9 Tb/s total capacity. Six channel simultaneous operation of a commercial transceiver module at 33 Gbaud is demonstrated for a variety of modulation formats including DP 16-QAM for >1.2Tbit/s aggregate data capacity.

Ultrafast optical pulse shaping supports a broad number of applications, ranging from ultrafast time-resolved spectroscopy to RF photonics [1]. Conventional pulse shapers rely on bulk optics and use liquid crystal spatial light modulators, with reconfiguration times limited to milliseconds. Integrated optical pulse shapers offer not only size advantage but also the potential for much faster reconfiguration by using electro-optic pulse shaping elements. Integrated pulse shapers usually employ an arrayed waveguide grating (AWG) to separate the input light into its constituent wavelengths, process each wavelength band using an array of on-chip components, and then recombine the light again relying on AWG action. AWG-based integrated pulse shapers with independent thermo-optic amplitude and phase control have been demonstrated in silica, but the reconfiguration time remains limited [2]. Our group previously reported a 32-channel InP arrayed waveguide grating pulse shaper (AWGPS) with 25 GHz channel spacing and an array of semiconductor optical amplifiers (SOAs) for spectral amplitude control. This work demonstrated amplitude shaping fidelity good enough to apply to RF photonic bandpass filtering with sidelobe suppression >35 dB as well as microsecond-scale reconfiguration [3]. Other groups have also demonstrated pulse shaping with integrated InP with either amplitude or phase control but not both [4]. In this work we report preliminary characterization of a 48 channel InP shaper at 50 GHz channel spacing, provisioned with both channel-by-channel phase adjusters and SOA gain elements (Fig. 1). To our knowledge this constitutes the first demonstration of an operable integrated InP pulse shaper with independent intensity and phase control.

We demonstrate 2-channel Tx and Rx PICs capable of delivering >700Gbps per channel (via 88Gbaud, 16-QAM dual-polarization modulation) over an 80km unamplified link with per channel extended C-band tunability.

We demonstrate a comb-based programmable radio-frequency photonic filter which uses an InP arrayed waveguide grating pulse shaper for comb apodization. RF photonic filtering with high stopband attenuation of > 36.4 dB is achieved with Gaussian apodization.

We present the development of large scale Photonic Integrated Circuits, high capacity optical module integration and their performance in a variety of data-center / metro and long-haul coherent optical link applications.

Over the past few decades optical pulse shaping has become an integral part of numerous photonic systems, impacting applications from optical communications to RF-photonic filtering [1]. In a parallel line, driven primarily by the need for broadband mass transmission of information, the technology behind photonic integration on the InP platform has continued to advance at a remarkable rate [2]. Leveraging these new fabrication methods researchers have developed an ever-increasing on-chip photonic tool set, which in turn is fueling a push for the migration of photonic solutions from bulk devices to a more marketable and scalable integrated platform. One of the most powerful tools one can envision is a fully functioning integrated pulse shaper. Particularly attractive is a shaper capable of working in the `line-by-line' regime where it has arbitrary amplitude and phase control over individual lines of an optical frequency comb. In this regime, user-defined complex spectral shapes and arbitrary temporal waveforms can be synthesized on demand, thereby facilitating applications like optical- and RF- arbitrary waveform generation [3], agile RF-photonic filtering [4], and coherent communications. In this contribution we present a 32 channel InP Arrayed Waveguide Grating Pulse Shaper (AWGPS) exhibiting line-by-line amplitude control at 25 GHz channel spacing.

We present data for long-haul, metro, and data-center applications using large scale Photonic Integrated Circuits (PICs) packaged in high capacity optical modules.

The status and progress of InP photonic integration is reviewed. Infinera has previously reported on the manufacturing of 100 Gb/s InP-based large-scale photonic integrated circuits. These PICs, based on amplitude modulation and with more than 50 discrete functions per chip, have now reached a high level of manufacturing maturity, and have furthermore redefined reliability standards for InP components, having achieved more than 900 million field hours without a single failure as of this writing. In this paper, we will describe manufacturing status for the 3rd generation of Infinera’s LS-PICs, which feature 500 Gb/s capacity using phase modulation on the transmitter chip, and coherent detection on the receiver chip, and which now form the heart of Infinera’s 500G DTN-X transport system, released in mid-2012. These new PICs have an order-of-magnitude increase in chip complexity, and a commensurate increase in fabrication complexity from III-V epitaxy through wafer fab, die fab, and test. The architecture and performance of Infinera’s PICs will be described, along with relevant yield and production metrics that demonstrate this platform is at once manufacturable and scalable.