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个人简介
Atom O. Watanabe (Graduate Student Member, IEEE) received the B.S. degree in applied physics from Keio University, Tokyo, Japan, in 2015, and the M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2019 and 2020, respectively.
From 2015 to 2020, he was with the 3D Systems Packaging Research Center, Georgia Institute of Technology, under the guidance of Prof. Rao R. Tummala and Prof. M. Swaminathan. As a Graduate Research Assistant at the RF/5G Glass Interposer Program, Georgia Tech PRC, Atlanta, he was involved in design and demonstration of high-performance and ultrathin antenna-integrated 3-D glass-based millimeter-wave (mm-wave) packages. He is currently with Qualcomm Inc., San Diego, CA, USA. His current research interests include package signal and power integrity, antenna integration, and RF/mm-wave system-on-package technology with electrical designs and processes.
Dr. Watanabe was a recipient of the Best Student Paper Award at the Future Car Workshop 2016 by SEMI, IEEE, CPMT, iMAPS, and iNEMI. His paper at the IEEE 67th Electronic Components and Technology Conference (ECTC) was selected as Most Popular Conference Paper in the IEEE Electronics Packaging Society (EPS) in 2017. He received the IEEE Electronic Packaging Society Japan Chapter Young Award in 2018.
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1004-1011, (2023)
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)pp.1590-1596, (2023)
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2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2022)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 3 (2021): 384-394
international microwave symposiumpp.339-341, (2021)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.544-549, (2021)
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