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职业迁徙
个人简介
Masaya Kawano received the B.S. and M.S. degrees in nuclear engineering from Osaka University, Osaka, Japan, in 1987 and 1989, respectively, and the Ph.D. degree in electronics and applied physics from the Tokyo Institute of Technology, Tokyo, Japan, in 2008.
In 1989, he joined NEC Corporation, Tokyo, where he was involved in cutting-edge research in the areas of infrared image sensors, Cu/low-k BEOL integration, and advanced packaging technologies for 22 years. He was with the EV Group Japan from 2011 to 2015 where he worked on wafer bonding, nanoimprint lithography for 3-D ICs, image sensors, LED, and MEMS applications. He joined the Institute of Microelectronics (IME), A*STAR, Singapore, in 2015. He is currently a Senior Scientist with the Heterogeneous Integration Department, where he is working on wafer-to-wafer/chip-to-wafer hybrid bonding, TSV, and FOWLP technologies. He has authored or coauthored more than 20 peer-reviewed journals and holds more than 60 U.S. patents granted.
Dr. Kawano has been invited to give talks and lectures at international conferences and workshops. He was a recipient of the IEEE EPTC Best Interactive Paper Award in 2017 and the IEEE ESTC Best Paper Award in 2010 for the works on FOWLP, and won the 13th SEMI Technology Symposium Award in 2006 for the work on stacked-chip memory.
研究兴趣
论文共 86 篇作者统计合作学者相似作者
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)pp.503-507, (2021)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.673-679, (2021)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.426-431, (2021)
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (2021)
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)pp.573-578, (2021)
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (2021)
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作者统计
#Papers: 87
#Citation: 1439
H-Index: 23
G-Index: 32
Sociability: 5
Diversity: 2
Activity: 1
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