5G antenna array covered by a novel frequency selective surface(FSS) is proposed in this paper for 5G antenna array applications. Proposed FSS has a pass-band between 3.3GHz to 3.8GHz with the transmission coefficient greater than −0.5dB, which has negligible impact on the antenna pattern, and the reflection coefficient of the FSS is greater than −1dB between 0.5GHz to 2.2GHz, which serves as a reflector for other band antennas. The antenna array below FSS consists of four elements operated in band of 3.3–3.6 GHz, and gains above 10dB are achieved with no pattern distortion.
The performance of the chirp stepped signal (CSS) is investigated in this paper. Based on the ambiguity function theory, a 60GHz radar system performance with CSS, such as, distance, speed and angle detection are firstly analyzed and then simulated and experimental verified. Finally, using our designed CSS, a higher signal-to-noise ratio (SNR) and improved range detection capability are obtained under the condition of low instantaneous bandwidth when compared with the FMCW signal. Our results show that the CSS has a good potential for 60GHz millimeter radar applications.
In Co-Packaged Optics (CPO) where optical devices and ICs are attached to a common base substrate, there are requirements to keep the temperature of high-heat-dissipating ICs as low as possible and also to keep the temperature of optical devices constant. We propose two solutions to meet these two requirements and show the effect of two solutions by simulation.
With the ever-increasing data rates, interconnect performance predictability becomes more and more challenging. Therefore, along with an accurate methodology, the quantification of measurement reproducibility and its impacts are essential in almost all aspects of high-speed interconnect validation. This paper investigates the reproducibility of S-parameter measurements before and after 2x-Thru de-embedding, and illustrates a multimetric correlation with uncertainty analysis.
SoC design, validation, and manufacturing teams all need to work in tandem to ensure a successful product is released to the market. Pre-silicon and post-silicon validation is critical and is performed to ensure minimal Si re-spins at the fabrication and avoid any design bugs reaching the end customer. The post-silicon debug of various power failures issues related to analog supply exhibiting random signatures induced learnings that can help expedite changes in post-Si validation and high-volume screening, Discussed in detail are the debug efforts to identify one of the many Analog Generation Supply (AGS) noise failure and isolation. The paper elucidates reports of the proposed defects and their various bearings, issue root causes, and issue validation suite formation.
