PCB设计走向何方? Where Are We Going with PCB Design? PCB技术路线图提供了当今电路板特性的主流值,如标出了不同铜箔的最小线宽/线距、不同板厚的最小孔径、厚径比和连接盘尺寸等.新PCB技术的驱动力是元器件规格尺寸,首先是BGA器件的节距,已经从1.27 mm到0.35 mm、0.30 mm,前沿工艺技术是mSAP.人工智能(AI)可以帮助PCB设计,人和机器之间的界限逐渐缩小,一些PCB设计将被AI替代,而PCB设计师的工作会一直存在.
Surface tension is the tension along any boundary of the liquid surface layer due to the disequilibrium of molecular gravity.In this paper,the surface tension of matal core printed circuit board(MCPCB)metal surface(aluminum-based)is taken as the research object.The key factors affecting the surface tension of printed circuit board(PCB)metal surface(aluminum-based)are obtained through experiments and analysis of the influencing factors such as different aluminum-based materials,different wordkflow processing for finished products,and different surface cleaning methods.
针对高频高速PCB需求的亮点技术 在TPCA Show 2023工研院首次展出五大亮点技术:(1)铜箔基板暨载板材料与验证技术,成功开发低损耗树脂暨铜箔基板材料、高导热增层绝缘材料,协助材料厂商进行树脂、添加剂、玻纤布与铜箔等多种原料评估验证.(2)低损耗底漆层材料技术,在无粗化铜箔表面涂布底漆层(Primer)来提升与树脂材料间的抗剥强度,兼具高抗撕强度与低传输损耗.(3)高厚径比TGV填孔电镀技术,采用独家配方专利,可制作孔AR大于10以上玻璃基板.(4)人机协作碰撞防护上下料AGV技术,打造之自动搬运车(AGV)结合AI辨识技术.(5)5D虚实整合智能工厂,以计算机视觉辨识、AI深度学习和大语言模型为核心基础,提升虚实融合.
In this paper,hydrocarbon resin is used as the basic resin platform to investigate the aging rules and other performances of the commonly used antioxidant 1010 and two new antioxidants(labeled A1 and A2)in this resin platform.The experimental results show that the addition of different types of antioxidants will have different degrees of negative effects on the performance of the board(DMA Tg,CTE).Antioxidant 1010 has good thermal oxidative aging resistance.However,the new antioxidant Al has more excellent anti-aging performance and has less impact on other properties.
0引言 印制电路板(printed circuit board,PCB)工厂有许多液体喷淋设备,需要配置压力表监控相关工艺参数.在水平生产线上均采用电子压力表,但电子压力表易损坏且单价高,造成工厂每年更换压力表的成本较高. 某公司共有20条水平生产线,每段蚀刻段有上下2条主喷管,每条主喷管有10个分支喷管,每个分支喷管都有1个独立电子压力表,全程共有2 736个压力表.其更换周期按5年一换,每年需要更换547个压力表,费用较高,不利于降低成本.
