MIMOSIS is a CMOS Monolithic Active Pixel Sensor developed to equip the Micro Vertex Detector of the Compressed Baryonic Matter (CBM) experiment at FAIR/GSI. The sensor will combine an excellent spatial precision of 5 µm with a time resolution of ∼5 µs and provide a peak hit rate capability of ∼ 80 MHz/cm 2 . To fulfill its task, MIMOSIS will have to withstand ionising radiation doses of ∼ 5 MRad and fluences of ∼ 7 × 10 13 n eq /cm 2 . This paper introduces the reticle size full feature sensor prototype MIMOSIS-2.1, which was improved with respect to earlier prototypes by adding on-chip grouping circuits and by improving the analog power grid. Moreover, it features for a first time a 50 μm epitaxial layer, which is found to improve the performances of the non-irradiated device significantly. We discuss the in beam sensor performances as measured during beam tests at the CERN-SPS.

The Belle II experiment at SuperKEKB continues to pursue high-precision measurements in Standard Model studies and in searches for physics beyond the Standard Model, with a target dataset of 50 ab$^{-1}$ and peak luminosities of $6\times10^{35}$ cm$^{-2}$s$^{-1}$. The current Vertex Detector (VXD), composed of the DEpleted P-channel Field Effect Transistor (DEPFET)-based Pixel Detector (PXD) and double-sided strip-based Silicon Vertex Detector (SVD), has achieved excellent tracking and vertexing performance through Run 1 and Run 2. To address future challenges from increased luminosity and background, a new all-pixel Vertex Detector (VTX) is under development, utilizing radiation-hard DMAPS technology based on the OBELIX sensor. In this contribution, we present the performance of the current VXD system, highlight operational challenges, and present the validation and integration status of the upcoming VTX upgrade.

The Micro Vertex Detector (MVD) is the most upstream detector of the fixed-target Compressed Baryonic Matter Experiment (CBM) at the future Facility for Antiproton and Ion Research (FAIR). It enables high-precision low-momentum tracking in direct proximity of the target. Reaching the stringent requirements for the MVD, a material budget of 0.3–0.5% X 0 per layer, operating the dedicated CMOS MAPS ('MIMOSIS') in the target vacuum, the strong magnetic dipole field, and a harsh radiation environment (5 Mrad, 7×10 13 n eq /cm 2 per CBM year), poses an unprecedented integration challenge. In this paper, the integration concept of the detector will be outlined, elaborating on the selection and preparation of materials, assembly procedures, and quality assessment steps in the ongoing preparation of pre-series production and detector commissioning in 2028.

In this work the initial performance studies of the first small monolithic pixel sensors dedicated to charged particle detection, called CE-65, fabricated in the 65nm TowerJazz Panasonic Semiconductor Company are presented. The tested prototypes comprise matrices of 64 x 32 square analogue-output pixels with a pitch of 15 mu m. Different pixel types explore several sensing node geometries and amplification schemes, which allows for various biasing voltage of the detection layer and hence depletion conditions and electric field shaping. Laboratory tests conducted with a Fe-55 source demonstrated that the CE-65 sensors reach equivalent noise charge in the 15 to 25 e(-) range and excellent charge collection efficiencies. Charge sharing is substantial for standard diodes, but can be largely suppressed by modifying their design. Depletion of the thin sensitive layer saturates at a reverse diode bias of about 5 V.

The International Linear Collider (ILC) is on the table now as a new global energy-frontier accelerator laboratory taking data in the 2030s. The ILC addresses key questions for our current understanding of particle physics. It is based on a proven accelerator technology. Its experiments will challenge the Standard Model of particle physics and will provide a new window to look beyond it. This document brings the story of the ILC up to date, emphasizing its strong physics motivation, its readiness for construction, and the opportunity it presents to the US and the global particle physics community.

The physics case of the International Linear Collider (ILC) is intended to encompass detailed studies of the Higgs boson and top-quark sectors as well as of fermion-pair production, complemented with direct searches for BSM physics manifestations. All these components of the physics programme involve flavour specific dynamical content, which calls for unprecedented performances of the charged particle detectors composing the experiments, special attention being devoted to the possibility to achieve ambitious flavour tagging performances. The latter benefit from the moderate radiation tolerance and read-out speed required, combined with the possibility to exploit the machine duty cycle for power saving, to achieve thereby a spatial resolution per detector layer of a few micrometres in both directions, combined with a material budget not exceeding 0.15 % of radiation length. Since the delivery of the ILC TDR IN 2012/13, substantial progress was achieved to develop a vertex detector fully suited to the physics requirements. Several pixel sensor approaches were followed, both from the technological and from the read-out architecture points of view. They are motivated by the capability to suppress the impact of beam related background, which dominates the hit density of the vertex detector, and tends to grow as the luminosity of the ILC is being upgraded to 4 to 6 times the baseline values. The paper summarises the performances achieved as well as the status and the perspectives of the different approaches. It shows that the possibility opens up to realise single bunch tagging with square pixels featuring less than 20µ m pitch and associated to a power consumption compatible with air cooling.

The International Linear Collider (ILC) being proposed in Japan is an electron-positron linear collider with an initial energy of 250 GeV. The ILC accelerator is based on the technology of superconducting radio-frequency cavities. This technology has reached a mature stage in the European XFEL project and is now widely used. The ILC will start by measuring the Higgs properties, providing high-precision and model-independent determinations of its parameters. The ILC at 250 GeV will also search for direct new physics in exotic Higgs decays and in pair-production of weakly interacting particles. The use of polarised electron and positron beams opens new capabilities and scenarios that add to the physics reach. The ILC can be upgraded to higher energy, enabling precision studies of the top quark and measurement of the top Yukawa coupling and the Higgs self-coupling. The international -- including European -- interest for the project is very strong. Europe has participated in the ILC project since its early conception and plays a major role in its present development covering most of its scientific and technological aspects: physics studies, accelerator and detectors. The potential for a wide participation of European groups and laboratories is thus high, including important opportunities for European industry. Following decades of technical development, R&D, and design optimisation, the project is ready for construction and the European particle physics community, technological centers and industry are prepared to participate in this challenging endeavour.

We have studied optimization of the design of a barrel-shaped pixelated tracker for given spatial boundaries. The optimization includes choice of number of layers and layer spacing. Focusing on tracking performance only, momentum resolution is chosen as the figure of merit. The layer spacing is studied based on Gluckstern's method and a numerical geometry scan of all possible tracker layouts. A formula to give the optimal geometry for curvature measurement is derived in the case of negligible multiple scattering to deal with trajectories of very high momentum particles. The result is validated by a numerical scan method, which could also be implemented with any track fitting algorithm involving material effects, to search for the optimal layer spacing and to determine the total number of layers for the momentum range of interest under the same magnetic field. The geometry optimization of an inner silicon pixel tracker proposed for BESIII is also studied by using a numerical scan and these results are compared with Geant4-based simulations.

Test beam measurements at the test beam facilities of DESY have been conducted to characterise the performance of the EUDET-type beam telescopes originally developed within the EUDET project. The beam telescopes are equipped with six sensor planes using MIMOSA 26 monolithic active pixel devices. A programmable Trigger Logic Unit provides trigger logic and time stamp information on particle passage. Both data acquisition framework and offline reconstruction software packages are available. User devices are easily integrable into the data acquisition framework via predefined interfaces.

IMIC is a Monolithic Active Pixel Sensor prototype for the MAPSSIC project dedicated to direct detection of low energy β+ rays in the brain of awake and freely-moving rats using CMOS technology. Former experiments using a β+ Si probe developed within the PIXSIC project validated a methodological proof of concept. However, conducting routinely such measurements would require improvements with respect to the passive pixel sensors employed in PIXSIC. The new IMIC circuit is fabricated in a 180 nm CMOS Image Sensor Technology and features a matrix of 16 × 128 pixels, which are 30 × 50 μm 2 large. The sensor has a needle-like aspect ratio (610 μm × 12 000 μm). The chip is produced on a 18 μm high-resistivity epitaxial layer substrate. The foreseen application requires high sensitivity to β-rays while being immune to background γ-rays. Another severe constraint is the limited power dissipation in order to minimize the thermal impact on the brain. IMIC is a fully-programmable digital sensor. The pixel design is based on the front-end architecture of the ALPIDE chip. However modifications have been made to store the information inside fired pixels between two readouts allowing low data throughput. The circuit is controlled through the SPI protocol, which allows for setting all the necessary polarization signals. The results of post-layout simulations show a high signal to noise ratio (>40) and low power dissipation of 115 μW/matrix. Laboratory characterization using β-rays validate these predictions and demonstrated that the slow readout can cope with the expected low activity (≈ 120 hits/matrix/s).

The need for miniaturized and versatile real-time radiation monitors has become a general trend for spacecraft applications. It requires a highly integrated detection system with the ability to count and identify ion species in a high-flux with mixed particles environment. We have proposed a new strategy to meet these requirements with a single CMOS pixel chip. This sensor is based on a matrix of 50×50 µm 2 pixels, read out in rolling-shutter mode, and features columns ended by 3-bit ADCs with tuneable threshold. An embedded digital algorithm extracts the particle properties from the pixel information to provide the radiation flux online. A reduced scale prototype with 32×32 pixels and 32 column-level ADCs has been designed and fabricated in a 0.35 µm CMOS process. The layout of the identifying and counting algorithm, downstream the pixel matrix, was developed in the same process. A full simulation of this layout for a subset of columns was used to check the algorithm output against a variety of inputs. The prototype was tested with X-rays, β- particles and laser illumination. Results confirm previous simulations addressing gain and linearity. Column-level ADCs also perform as expected. Those measurements validate the possibility to monitor proton and electron fluxes up to 10 7 particles·cm -2 ·s -1 and to distinguish protons from electrons for energies lower than 50 MeV. A brief review of this first prototype design and tests is presented in this paper.

CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a small pixel pitch (∼ 20 μ m) and low material budget (∼ 0.2-0.3% X_0) per layer. These characteristics make CPS an attractive option for vertexing and tracking systems of high energy physics experiments. Moreover, thanks to the mass production industrial CMOS processes used for the manufacturing of CPS the fabrication construction cost can be significantly reduced in comparison to more standard semiconductor technologies. However, the attainable performance level of the CPS in terms of radiation hardness and readout speed is mostly determined by the fabrication parameters of the CMOS processes available on the market rather than by the CPS intrinsic potential. The permanent evolution of commercial CMOS processes towards smaller feature sizes and high resistivity epitaxial layers leads to the better radiation hardness and allows the implementation of accelerated readout circuits. The TowerJazz 0.18 μ m CMOS process being one of the most relevant examples recently became of interest for several future detector projects. The most imminent of these project is an upgrade of the Inner Tracking System (ITS) of the ALICE detector at LHC. It will be followed by the Micro-Vertex Detector (MVD) of the CBM experiment at FAIR. Other experiments like ILD consider CPS as one of the viable options for flavour tagging and tracking sub-systems.

A 180 nm imaging CMOS technology is being used to develop CMOS pixel sensors (CPS) for the upgrade of the ALICE Inner Tracking System (ITS) [1, 2]. The process allows in particular for full CMOS integration inside the pixels thanks to the available deep P-wells. Therefore, a novel concept of pixel with integrated discriminator was realized in order to develop a fast and powerefficient rolling shutter CPS architecture, called ASTRAL. Compared with the conventional CPS using column-level discrimination, the in-pixel discrimination sets the analogue processing within the pixel. Thus the analogue buffer driving the long-distance column bus is no longer needed and the static current consumption per pixel can be largely reduced, from 120 μA down to less than 15 μA. Moreover, the row processing time can be halved down to 100 ns thanks to small local parasitics. As a proof of concept, the prototype chip called AROM-0 was developed. Full functionality and noise performance of the chip have been validated in laboratory. Based on AROM-0, improved pixel designs have been implemented in the series of more advanced chips called AROM-1, which incorporate the intermediate design anticipating the upstream architecture of ASTRAL. It features an array of 64 × 64 pixels with double-row readout while integrating on chip the JTAG programmable biasing/reference and sequence control circuitry. This paper will mainly present the design and laboratory test results of AROM-0 and AROM-1 chips. Also, a brief introduction to the first prototype chip of the full scale building block for ASTRAL will be given, supposed to verify the full chain and functionality of the ASTRAL sensor.

The future International Linear Collider (ILC) is expected to provide an ideal environment for high precision measurements.In order to fully exploit it, very sensitive detectors are required.This applies in particular to flavour tagging, which relies on the realisation of a particularly granular and low mass vertex detector.CMOS pixel sensors are considered since long as an option for a vertex detector of ILD, one of the two experimental concepts developed for the ILC.The required, non-trivial, trade-off between high granularity, fast enough read-out and low power is achieved by combining a rolling shutter sensor architecture with a double-sided ladder design.This approach is followed in the ILD Detector Baseline Document (DBD) to be handed over to the review committee IDAG by the end of 2012, and will be presented in the first part of the proceedings.In the second part, a faster sensor architecture will be addressed, based on in-pixel discrimination and highly parallelised rolling-shutter read-out.Expected to accelerate the read-out by nearly an order of magnitude, it exploits a newly addressed CMOS technology with 0.18 µm feature size (instead of the 0.35 µm process used previously).We will overview the perspectives and activities of this new step of the R & D, which is expected to allow for vertex detector based standalone tracking and to face the enhanced beam background [1] foreseen at the highest energy operation of the ILC (≥ 1TeV ).In particular, the test beam results obtained with the first sensor prototypes will be summarised, focusing on the charged particle detection performances of the technology.

CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher read-out speed and radiation tolerance than those achieved with the available devices based on a 0.35μm feature size technology. This paper shows preliminary test results of new prototype sensors manufactured in a 0.18μm process based on a high resistivity epitaxial layer of sizeable thickness. Grounded on these observed performances, we discuss a development strategy over the coming years to reach a full scale sensor matching the specifications of the upgraded version of the Inner Tracking System (ITS) of the ALICE experiment at CERN, for which a sensitive area of up to ∼10m2 may be equipped with pixel sensors.

This report reviews current trends in the R&D of semiconductor pixellated sensors for vertex tracking and radiation imaging. It identifies requirements of future HEP experiments at colliders, needed technological breakthroughs and highlights the relation to radiation detection and imaging applications in other fields of science.

We discuss two projects exploring the integration of thin CMOS pixel sensors in order to prototype ladders matching the geometry needed for the ILD vertex detector. The PLUME project has designed and fabricated full-size and fully functional double- sided layers which currently reach 0.6 % X0 and aim for 0.3 % X0 in mid-2012. Another approach, SERNWIETE, consists in wrapping the sensors in a polyimide-based micro-cable to obtain a supportless single-sided ladder with a material budget around 0.15 % X0. First promising samples have been produced and the full-size prototype is expected in spring 2012.

A. Besson ∗a, M. Winter a, J. Baudot a, G. Bertolone a, N. Chon-Sen a, G. Claus a, C. Colledani a, Y. Degerli b, A. Dorokhov a, G .Dozière a, W. Dulinski a, M. Gelin a, A. Geromitsos a, M. Goffe a, A. Himmi a, C. Hu-Guo a, K. Jaaskelainen a, F. Morel a, H. Phama, C. Santos a, S. Senyukov a, M. Specht a, M. Szelezniak a, I. Valin a, G. Voutsinas a. a IPHC/IN2P3/CNRS Université de Strasbourg Strasbourg, France b IRFU/SEDI CEA Saclay, France