Sheng-Tsai Wu - Electronics & Optoelectronics Research Laboratory, Industrial Technology Research Institute (ITRI)

基本信息

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职业迁徙

个人简介

Sheng-Tsai Wu received the M.S. degree in mechanical engineering from National Central University, Zhongli, Taiwan, in 2008. He has been with the Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan, since 2008. His current research interests include computational modeling and thermomechanical analysis, and reliability engineering of advanced packaging.

研究兴趣

论文共 41 篇作者统计合作学者相似作者

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Parasitic Component and Gate Resistance Effects of Internal and External Package Level on Switching Performance of SiC Power Module

Nguyen-Nghia Do,Sheng-Tsai Wu, Tai-Jyun Yu, Chen-Min Chen, Jing-Yao Chang, Wei-Zhong Huang, Zhen-Yi Liao, Yuan-Zhe Zhang

PCIM Europe 2024 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1423-1428, (2024)

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A novel multi-chip stacking technology development using a flip-chip embedded interposer carrier integrated in fan-out wafer-level packaging

Yu-Min Lin,Wei-Lan Chiu,Chao-Jung Chen,Hsiang-En Ding,Ou-Hsiang Lee,Ang-Ying Lin,Ren-Shin Cheng,Sheng-Tsai Wu,Tao-Chih Chang,Hsiang-Hung Chang,Wei-Chung Lo,Chia-Hsin Lee,Jennifer See,Baron Huang,Xiao Liu, Te Pei Hsiang,Chang-Chun Lee

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1076-1081, (2021)

引用1浏览0EIWOS引用

Innovative High Density Power Module for E-Scooter Motor Using a High Performance Insulated Metal Substrate

Kuo-Shu Kao,Sheng-Tsai Wu,Ji-Yuan Syu,Tao-Chih Chang,Chang-Chun Lee

semanticscholar（2021）

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Effects of Thermal Characteristics of Power Module on Electric Vehicle Inverter

Chun-Kai Liu,Po-Kai Chiu, Shi-Feng Hsu,Han-Lin Wu,Sheng-Tsai Wu, Wen-Shang Lai, Hung-Hsiao Liu, Ming-Tsung Lee

2021 16TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)pp.143-146, (2021)

引用3浏览0EIWOS引用

Versatile Laser Release Material Development for Chip-First and Chip-Last Fan-out Wafer-Level Packaging

Chia-Hsin Lee,Baron Huang,Jennifer See,Xiao Liu,Yu-Min Lin,Wei-Lan Chiu,Chao-Jung Chen,Ou-Hsiang Lee,Hsiang-En Ding,Ren-Shin Cheng,Ang-Ying Lin,Sheng-Tsai Wu,Tao-Chih Chang,Hsiang-Hung Chang,Kuan-Neng Chen

Electronic Components and Technology Conferencepp.736-741, (2021)

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Electrical, Thermal and Stress Simulation Analyses of SiC MOSFET Power Integrated Module (PIM) Development

Sheng-Tsai Wu,Po-Kai Chiu,Yu-Hua Cheng,Hsin-Han Lin,Han-Lin Wu,Tai-Jyun Yu, Tzu-Hsuan Ni, Chun-Hua Tseng, Meng-Tsung Yeh, Cheng-Yi Wang,Chih-Ming Tzeng,Kuo-Shu Kao

2021 IEEE INTERNATIONAL FUTURE ENERGY ELECTRONICS CONFERENCE (IFEEC)pp.1-5, (2021)

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The development of high performance in hybrid SiC power integrated module (PIM)

Jing-Yao Chang,Su-Yu Fun,Sheng-Tsai Wu,Fang-Jun Leu, Yuan-Yin Lo,Po-Kai Chiu,Tai-Jyun Yu,Han-Lin Wu,Wei-Kuo Han,Chih-Ming Tzeng, Shi-Feng Hsu,Kuo-Shu Kao,Hsin-Han Lin,Tao-Chih Chang, Shinichi Yamauchi,Kei Anai,Jung-Lae Jo,Takahiko Sakaue

PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-5, (2020)

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Double-Sided Cooling SiC Power Module Packaging for Industrial Motor Driving System