Journal of Japan Institute of Electronics Packaging (1343-9677) | AMiner期刊详情 | AMiner

Journal of Japan Institute of Electronics Packaging (1343-9677) | AMiner期刊详情 | AMiner

年发文量

研究主题

论文（2259）

排序

时间引用

1Warpage Analysis and Control of Semiconductor Packages: A Copper-Clad Laminate Perspective

Kosuke Murai,Hirokazu Noma, Yuichi Yanaka, Ryota Yambe

2026

引用

2Hybrid Bonding Technology: Challenges and Recent Trends

Bungo Tanaka, Takafumi Fukushima

2026

引用

3Novel Gap-Filling Solution Based on Excellent Heat-Resistant Resin Materials for Advanced Heterogeneous Integration

Yohei Abiko, Tsuyoshi Kida, Kentaro Ishii, Aiko Koda, Haruka Yasufuku, Riki Kondo

2026

引用

4Automation Systems for PLP Mass Production: Requirements and Challenges

Kenji Miyake

2026

引用

5Outlook of Miniaturization of Next Generation Semiconductor Package Substrate and RDL

Eiichiro Yamasaki, Kento Eguchi

2026

引用

6Transformation of Inspection Methodologies for Advanced Semiconductor Manufacturing —toward Quality “languisticization” Bridging Development and Mass Production—

Yoshitaka Adachi, Yujin Fujita, Yoshiteru Kono

2026

引用

7Effects of Coating Solvents on Chemical Composition Distribution and EUV Sensitivity Characteristics in PHS-Boc Resist Thin Films

Kouji Kuramoto,Shinji Yamakawa

2026

引用

8Transparent Optical Adhesives for Co-Packaged Optics (CPO) in Silicon Photonics

Noriyuki Sakai, Fumiya Suzuki

2026

引用

9Proposal of Statistical Analysis Method of Common-Mode Current on Twisted Pair Line with Variations in Line Height and Deflection Using Polynomial Chaos Methods

Yuto Hachiga,Yoshiki Kayano,Fengchao Xiao

2026

引用

10High Productivity and Fine Electrode Pitch Die-to-Die Connection Technology for Pillar-Suspended Bridge (PSB) Chiplet Integration Technology

Ichiro Kono,Yoichiro Kurita

2026

引用

11Advances and Challenges in High-Speed Optical Device Technologies

Shigeru Kanazawa

2026

引用

12Introduction to the Special Edition

Masahisa Fujino

2026

引用

13Trends, Predictions, and Challenges about Materials for Photonic Integrated Circuits (PIC) Packaging & Technology for Passive Optical Components

Hideyuki Nawata

2026

引用

14The Importance of Ph.D. Talent

Eiji Higurashi

2026

引用

15Overall Overview of the 2025 Optical Circuit Packaging Technology Roadmap and the Evolution of Co-Packaged Optics (CPO)

2026

引用

16Photonics-Electronics Integration Research Center, AIST

2026

引用

17Development and Characterization of Multi-Walled Carbon Nanotube-Based Dielectric Sheets for Electromagnetic Shielding and Absorption

Jiacheng He, Kenji Kojio, Dan Suzuki, Kishio Hidaka,Sho Muroga

2026

引用

18Research Institute for Electromagnetic Materials

Naoki Wako

2026

引用

19Improving Flame Retardancy and Heat Resistance of Printed Circuit Board Materials Via Poly(2,6-dimethyl-1,4-phenylene Sulfide) Blending

Daisuke Ito, Shinsuke Ishikawa, Hidenori Fujimoto, Akihiko Happoya, Makoto Nagata

2026

引用

20Introduction to the Special Edition

Yasunobu Matsuoka

2026

引用

高被引作者

作者	引用	发文
Michael Pecht	356	1
Hideo Honma	333	44
Masazumi Amagai	303	7
Toshikazu Shibuya	240	1
Masaki Omiya	240	1
Kikuo Kishimoto	240	1
Masami Nakamoto	162	2
qiang yu	151	15
T. Nagaoka	139	1
Y. Morisada	139	1

高产作者

作者	引用	发文
Hideo Honma	333	44
Sachio Yoshihara	43	19
Fukuro Koshiji	51	17
Ikuo Shohji	56	16
Toru Ikeda	60	16
qiang yu	151	15
Yoichi Shiraishi	30	15
noriyuki miyazaki	63	13
Masaaki Koganemaru	37	13
Mitsuhiro Watanabe	57	12

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