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    European Solid-State Device Research Conference

    European Solid-State Device Research Conference

    Conference

    年发文量

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    论文(3787)

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    140Nm SONOS Embedded Select in Trench Memory
    Radouane Habhab,Vincenzo Della Marca,Pascal Masson, Nadia Miridi,Clement Pribat,Simon Jeannot,Thibault Kempf,Marc Mantelli,Philippe Lorenzini, Jean-Marc Voisin,Arnaud Regnier,Stephan Niel,

    In this paper, we discuss a new development of 40nm SONOS eSTM™ (embedded Select in Trench Memory). We present an experimental study based on hot carrier injection mechanism for both programming/erase operations, performed on this new eNVM architecture. The optimization of drain and select gate biases, in order to define the programming and erasing threshold voltages, is also detailed. All the characterizations have been carried out for two different SONOS eSTM™ architectures giving an opportunity to propose different solutions. One of this using a continuous silicon nitride layer for two neighbour cells, taking advantage on the discrete charge trapping nature. As well, we performed endurance tests up to one million cycles for both architectures to evaluate the memory endurance.

    2023引用:1
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    2NPN Si/SiGe Memory Selector with Non-Linearity>10 and ON-current>6MA/cm.
    Gaspard Hiblot,Taras Ravsher,Roger Loo,Bhuvaneshwari Yengula Venkata Ramana, Nathali Franchina-Vergel,Andrea Fantini,Shamin Houshmand Sharifi,Nina Bazzazian,Kurt Wostyn, Loris Angelo Labbate,Sebastien Couet,Gouri Sankar Kar
    2023
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    3Electrothermal Modeling of Junctionless Vertical Si Nanowire Transistors for 3D Logic Circuit Design
    Yifan Wang,Chhandak Mukherjee,Houssem Rezgui,Marina Deng,Cristell Maneux,Sara Mannaa,Ian O'Connor,Jonas Mueller,Sylvain Pelloquin,Guilhem Larrieu

    This work presents a comprehensive analysis of electrothermal effects in emerging 3D vertical junctionless nanowire transistors (VNWFETs) using on-wafer measurements under a wide range of temperature and validated against numerical and compact model simulations. Experimental observations indicate an increase of the drain current with the temperature, conforming to the behavior of junctionless FETs. Multiphysics simulations reveal formation of temperature hot-spots that adversely affect thermal conductivity in smaller geometries. The VNWFET compact model was then modified to account for the underlying electro-thermal effects as well as dynamic self-heating. Model simulations and the experimental results at different measurement temperatures for different transistor geometries show good agreement. The developed SPICE-compatible compact model was then used for studying the impact of electrothermal effects on the performances of basic 3D logic circuits.

    2023
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    4Modeling the Temperature Dependence of TDDB in Galvanic Isolators Based on Polymeric Dielectrics
    Jurij L. Mazzola,Matteo Greatti,Christian Monzio Compagnoni,Alessandro S. Spinelli,Dario Paci, Fabrizio Speroni, Vincenzo Marano, Michele Lauria,Gerardo Malavena

    We present an analytical model to reproduce the non-monotonic temperature dependence of Time-Dependent Dielectric Breakdown (TDDB) in galvanic isolators based on polymeric dielectrics. The model is based on the concurrent action of two competing mechanisms involved in the TDDB dynamics, namely the worsening of the polymer dielectric strength due to moisture and the outdiffusion of water molecules during the electrical stress phase. By catching the most relevant features of the temperature dependence of TDDB in a simple yet effective way, the model represents a valuable tool to support the design of galvanic isolators based on polymeric dielectrics.

    2023引用:1
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    5Static and Dynamic Stochastic Analysis of a Temperature-Sensitive VO2 Spiking Neuron
    Noemie Bidoul,Teodor Rosca, Adrian M. Ionescu,Denis Flandre

    In this work, we investigate the intrinsic cycle-to-cycle variations in a spiking temperature-sensitive neuron, based on the resistive switching of a Vanadium dioxide (VO 2 ) two-terminal device. We study how this phenomenon impacts the spike rate jitter, and affects the spiking sensor precision. To do so, we combine a statistical analysis of the device DC characteristics, with measurements of the spiking neuron in dynamic operation from 41 to 47 °C. Using an analytical dynamic model, we reveal that the VO 2 cycle-to-cycle variations of the insulating resistance and insulator-to-metal threshold voltage dominate the stochastic processes. Our spiking sensor achieves large, linear sensitivity (1.71 kHz/°C) and high resolution (0.024 °C for a 10 ms-long observation), attributed to its small cycle-to-cycle variations.

    2023引用:4
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    高被引作者

    作者引用发文
    Chris Van Hoof13986
    Ruud Vullers11372
    I Doms11372
    R. Mertens11164
    Rob Van Schaijk11002
    Gerard Ghibaudo98264
    Thomas Skotnicki73434
    Siegfried Selberherr62647
    Guido Groeseneken58832
    Sorin Cristoloveanu55844

    高产作者

    作者引用发文
    Gerard Ghibaudo98264
    Siegfried Selberherr62647
    Sorin Cristoloveanu55844
    Mihai Adrian Ionescu55638
    Thomas Skotnicki73434
    Guido Groeseneken58832
    Antonio Gnudi25528
    Susanna Reggiani25228
    Denis Flandre34527
    Giorgio Baccarani37726

    相关期刊

    International Conference on IC Design & Technology
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    International Conference on Microelectronic Test Structures
    Symposium on VLSI Technology
    International Integrated Reliability Workshop
    International Electron Devices Meeting
    International Conference on Simulation of Semiconductor Processes and Devices