PCB设计走向何方? Where Are We Going with PCB Design? PCB技术路线图提供了当今电路板特性的主流值,如标出了不同铜箔的最小线宽/线距、不同板厚的最小孔径、厚径比和连接盘尺寸等.新PCB技术的驱动力是元器件规格尺寸,首先是BGA器件的节距,已经从1.27 mm到0.35 mm、0.30 mm,前沿工艺技术是mSAP.人工智能(AI)可以帮助PCB设计,人和机器之间的界限逐渐缩小,一些PCB设计将被AI替代,而PCB设计师的工作会一直存在.
Surface tension is the tension along any boundary of the liquid surface layer due to the disequilibrium of molecular gravity.In this paper,the surface tension of matal core printed circuit board(MCPCB)metal surface(aluminum-based)is taken as the research object.The key factors affecting the surface tension of printed circuit board(PCB)metal surface(aluminum-based)are obtained through experiments and analysis of the influencing factors such as different aluminum-based materials,different wordkflow processing for finished products,and different surface cleaning methods.
针对高频高速PCB需求的亮点技术 在TPCA Show 2023工研院首次展出五大亮点技术:(1)铜箔基板暨载板材料与验证技术,成功开发低损耗树脂暨铜箔基板材料、高导热增层绝缘材料,协助材料厂商进行树脂、添加剂、玻纤布与铜箔等多种原料评估验证.(2)低损耗底漆层材料技术,在无粗化铜箔表面涂布底漆层(Primer)来提升与树脂材料间的抗剥强度,兼具高抗撕强度与低传输损耗.(3)高厚径比TGV填孔电镀技术,采用独家配方专利,可制作孔AR大于10以上玻璃基板.(4)人机协作碰撞防护上下料AGV技术,打造之自动搬运车(AGV)结合AI辨识技术.(5)5D虚实整合智能工厂,以计算机视觉辨识、AI深度学习和大语言模型为核心基础,提升虚实融合.
In this paper,hydrocarbon resin is used as the basic resin platform to investigate the aging rules and other performances of the commonly used antioxidant 1010 and two new antioxidants(labeled A1 and A2)in this resin platform.The experimental results show that the addition of different types of antioxidants will have different degrees of negative effects on the performance of the board(DMA Tg,CTE).Antioxidant 1010 has good thermal oxidative aging resistance.However,the new antioxidant Al has more excellent anti-aging performance and has less impact on other properties.
0引言 印制电路板(printed circuit board,PCB)工厂有许多液体喷淋设备,需要配置压力表监控相关工艺参数.在水平生产线上均采用电子压力表,但电子压力表易损坏且单价高,造成工厂每年更换压力表的成本较高. 某公司共有20条水平生产线,每段蚀刻段有上下2条主喷管,每条主喷管有10个分支喷管,每个分支喷管都有1个独立电子压力表,全程共有2 736个压力表.其更换周期按5年一换,每年需要更换547个压力表,费用较高,不利于降低成本.
Surface dent defects often occur during the manufacturing process of embedded copper block printed circuit boards(PCBs),which bring hidden dangers to the solderability of subsequent chip pads and the patch processes.To address this issue,we conduct research from four dimensions:pre-large size of buried copper slots,glue removal method,plate selection,and non-exposed dry film size.Preliminarily increasing the diameter of the embedded copper slot hole by 0.075 mm can effectively reduce the dent defects on the surface of the embedded copper.The glue removal method is set as"non-woven glue removal twice+chemical glue removal once",which can achieve no residual glue flow between the copper block and the board surface.Sheet S1000-H has better fluidity than IT180A,and the defect rate can be reduced by more than a half.The non-exposed dry film area at the slot is designed to be 0.076 mm larger than the slot,which can effectively reduce internal short circuits.Choosing the appropriate in-reserve size rate of buried copper slots,glue removal method,plate material,and non-exposed dry film size can effectively reduce dent defects on the surface of PCB embedded copper.
Phosphate ester(TPP,CDP,IPPP)is a common material for paper based copper clad laminate(CCL)and composite base CEM-1 CCL.With the promulgating of environmental laws and regulations,some phosphate ester materials have been banned or restricted,and replacing of environmental restriction/prohibition phosphate ester will become the development trend of CCL.The application of environmental plasticizer in CCL shows that environmental plasticizer can replace controlled phosphate ester to achieve the same processing effect as phosphate ester.This paper focuses on the phosphate ester related laws and regulations,the feasibility of plasticizer to replace environmental control phosphate ester technology,the definition,classification,function,and mechanism of action of plasticizer,environmental protection plasticizer and so on,hoping to provide theoretical and technical reference for environmental friendliness of CCL.
High speed materials used very low polar groups in the polymer chain when designing the resin,so as to achieve low Dk and Df.However,the wettability between resin and glass fiber will be greatly reduced,and the haloing issue will be found after drilling and copper plating.Aiming at these problems,driling parameters,types of drill bits,and desmear parameters were researched.The results showed that,chemical desmear and drilling parameters were the key factors of haloing.Reducing the chemical desmear strength can lowering the haloing,but it also can lead to copper inner connection defect(ICD)problem.Using high rotation speed(0.25 mm drill bit with a 130 kr/min rotation speed)and high chip load for drilling can lead to a lower haloing after drilling and copper plating,and coating drill bits will have less influence on haloing.
The preparation method of a modified polyvinylidene fluoride resin composition and a copper clad laminate is introduced.In this paper,barium titanate ceramic powder is added to the preparation of the modified polyvinylidene fluoride,which can enhance the adhesive force and enhance the toughness.At the same time,the curing temperature of the resin composition is reduced and the storage stability is improved,and the application in the copper clad laminate can not only effectively improve the heat resistance,but also improve the electrical properties.Its application leads to lower dielectric constant and dielectric loss,good mechanical strength,high heat resistance,and high glass transition temperature,and greatly reduce the cost.
一、整体概况 2023年三季度,中国电子电路行业受益于国内外市场需求的回暖和政策支持的持续推进,营收与净利润整体都较好于二季度.截至2023年11月3日,电子电路行业在A股上市公司共有76家,其中PCB制造41家,材料25家,设备8家,环保2家,已经全部披露完2023年三季度财务数据.75家上市公司(可比数据75家,下同)2023年三季度合计营业收入805.31亿元人民币,降幅收窄同比至2.2％,环比今年二季度增长11.1％;合计净利润42.21亿元人民币,同比去年三季度下降33.7％,环比今年二季度增长91.9％.
0引言 某客户一款14层多层印制电路板(printed circuit board,PCB),导线阻抗规格为(85±8.5)Ω.A厂商生产的成品阻抗不良比例20％,从阻抗量测时域反射技术(time domain reflectometry,TDR)波形来看,L1层经过导通孔再穿至L10的过程,显示在导通孔处的阻抗过低,已超出规格值.
11月6日,在由中国电子电路行业协会CPCA组织的科技成果鉴定会上,惠州市金百泽电路科技有限公司(以下简称"惠州金百泽")联合北京理工大学深圳汽车研究院(电动车辆国家工程实验室深圳研究院)(以下简称"北理深汽院")完成的"新能源汽车电机控制模块关键技术研究及产业化"项目顺利通过科技成果鉴定,鉴定会专家组一致认为:该产品整体技术指标达到国际先进水平.
2023年即将过去,在今年初,大家都以为历时约3年的新冠疫情结束后,可以摆脱束缚,迈入经济恢复发展的新轨道.然而现实并非如此,在市场有限、产能过剩的情况下,整个行业出现负增长的大势无法扭转,这是极不寻常的一年. 经济虽然差劲,但技术发展并未停步.人们都坚信经济会重新向好,电子电路产业会继续发展.在这一年里,本刊照常出版发行,通过介绍新技术、开展技术交流,助力技术创新和进步,为破解企业经营困境出力.
To solve the quantification problem of the Galvanic effect,a Galvanic measuring instrument was used to measure the electrode potential and Galvanic current of chemical and electrochemical corrosion,and the influence of various parameters of the micro etching tank on the Galvanic effect was studied.The results showed that by measuring and monitoring the electrode potential,the electrochemical corrosion situation of the micro etching tank solution can be accurately grasped,thus allowing the Galvanic current problem to be data-driven and controlled.
Electroless copper plating and electroplating copper are key processes for hole metallization in printed circuit boards(PCBs).The interconnection structures of the bottom of blind holes and the inner layer of through holes both have a bonding interface among electroplating copper,electroless plating copper and base copper.The quality of the copper plating layer is a key factor affecting the interfacial bonding strength.The article analyzes the typical micro morphology of copper plating layer micro voids,blind hole bottom,and inner layer interconnection interface failures in the hole metallization process,and analyzes the effects of process factors on the quality of copper plating and interface bonding strength.This provides reference for the production quality control,interface bonding strength improvement,and product reliability improvement of electroless copper plating.
The free bonded film is a combination of conductive material including coating,copper film layer and conductive adhesive layer,which has the function of piercing the steel sheet connected by the electromagnetic interference(EMI)shielding film layer.It improves the design of EMI window avoidance for the ground conduction between the existing flexible printed circuit board(FPCB)and the steel sheet.This paper mainly studies the change of resistance values of FPCB and steel sheet under different ground bonding pad conditions with free bonded film and different EMI shielding film,and obtains the best material combination design without EMI window avoidance,which provides reference for the shield and grounding conduction design of FPCB.
This paper illustrates the main test methods used in high voltage conductive anodic filamentation(CAF)resistance test for printed circuit board(PCB)used in electrical vehicles,the differences between high voltage CAF test and the traditional ones,the test results demonstrated by the high voltage CAF test,and its failure modes as well as the influence of defects on the high voltage CAF test.An analysis on test results produces some experience and data on how to improve the test pass rate.Meanwhile,it is found that the use of materials of high glass transition temperature(high Tg)and low coeficient of thermal expansion(CTE),and the safe pattern space could effectively reduce the occurrence of CAF,electrochemical migration(ECM)and breakdown.
The dificulties in mechanical drilling of the core layer of packaging substrate,the failure mechanism of micro drilling,and common drilling quality issues were analyzed.Four types of micro drills with different flute shapes were designed and integrated with three coatings.The chip removal capability,drilling temperature,tool wear,hole position accuracy,and hole wall roughness when using various micro drills in processing the core layer of FC-BGA packaging substrate were investigated and compared.The optimal flute shape and coating integrated design was selected.The results show that the integrated design of flute B,C and SHC coating,as well as the integrated design of flute C,D and NC coatings,can meet the quality requirements after processing 7 000 holes;the integrated design of flute D and NC coating,which can process 10 000 holes to meet quality requirements,is an effective solution to the drilling of the core layer of packaging substrate.
为丰富杂志内容,适应更多层次读者需求,为提高行业技术水平打下基础.《印制电路信息》期刊特开设"电子电路知识园地"专栏.该"知识园地"专栏的内容主要是对行业内某项技术或事物进行解释与说明,以便统一认识.
With the development of the electronics industry,printed circuit board(PCB)design is more and more prone to high multi-layer,small pitch ball grid array(BGA)products,which puts forward high alignment accuracy requirements for PCB manufacturers.Usually,the biggest factor affecting PCB alignment accuracy is the expansion,and the expansion are mainly affected by copper-coated substrate,prepreg(PP),etc.This paper verifies the effect of PP manufacturing process change on product growth and shrinkage by comparing the changes before and after filler ball milling process change.
