Electrostatic dissipative polymers are used to control ESD in electronics and automotive industries, but rarely in applications that prevent ignitions of flammable substances. The risks of electrostatic hazards are generally reduced by connecting electrically conductive objects to earth. This technical paper shows advantages of dissipative polymers compared to conductive materials.
An effective approach to obtain optimal desired characteristics of HV dual-direction SCR ESD protection cell in HV power BCD process is presented. Based on experimental results the proposed dual direction system level ESD cell is realized in form of two independently optimized complementary sub-cells with dedicated positive P-DDSCR and negative N-DDSCR high current path.
ESD control items are generally characterized by direct current measurements at certain voltage levels. Discharge resistance may, however, have a remarkable voltage and frequency dependency. We have assessed conductive polymers by comparing the resistivities of the solid planar objects with the resistances of electrostatic discharges. Conductive polymers may have applicable characteristics of current attenuation for ESD control items.
In this invited paper, we provide an overview of the challenges and solutions to ensure Zero Defect (ZD) quality for the automotive semiconductor products from test viewpoint. We start with an overview of the defect classification and acceleration of latent defect, followed by review of recent developments of automotive semiconductor test. Next we present an overview of automotive production test flow and discuss the increased Electrical Over Stress (EOS) risk associated with Package-Level Burn-In (PLBI) and the recent work on reducing the risk using Wafer Level Stress for automotive semiconductors. Moreover, we will provide an in-depth review of the key advanced stress and test components including the enhanced High Voltage Stress Test (HVST) and enhanced Advanced Outlier Limits (AOL) screening and the enabling Design for ZD methodology, as well as their implication to EOS/ESD community.
An ESD analysis is carried out for bandwidth extension circuits composed of three inductor segments and integrated with distributed ESD protection. The tri-coil bandwidth extension circuit is proposed for wireline receivers. TLP and S-parameter measurements are used to benchmark the tri-coil’s performance against that of a more conventional T-coil.
